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74VHC125TTR

STMicroelectronics

74VHC125TTR by STMicroelectronics

74VHC125TTR by STMicroelectronics is a 4-function bus driver with a propagation delay of 8.5ns at 3.3V, suitable for military-grade applications. It features a max I (ol) of 8A, operates b/w -55 to 125 °C, and has a small outline package style for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,027 parts In-Stock

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4,027

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Digiode

USA . 2,013 parts In-Stock

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2,013

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Anansix

USA . 1,259 parts In-Stock

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1,259

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Distributors (Availability)

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Microchip USA

USA . 390 parts In-Stock

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$2.439

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390

$2.439

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Andel Nordic

Denmark . 1,536 parts In-Stock

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$6.838

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-

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$6.564

10k+ parts

$6.564

1,536

$6.838

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$6.564

$6.564

AZTECH Wire

Italy . 1,083 parts In-Stock

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$21.540

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1,083

$21.540

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IDEA Electronic Components Group

UK . 1,335 parts In-Stock

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$22.756

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$20.481

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$22.756

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$20.481

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MKK Technologies

India . 24 parts In-Stock

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$42.792

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24

$42.792

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DigiPath Technology Company

USA . 24 parts In-Stock

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$42.792

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24

$42.792

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Metaverse IC Inc.

Canada . 18,599 parts In-Stock

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Perfect Parts

USA . 18,377 parts In-Stock

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RC Electronics

USA . 6,750 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,464 parts In-Stock

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Corphita

USA . 3,172 parts In-Stock

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Parana Technologies

USA . 1,758 parts In-Stock

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$27.208

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$27.208

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Native Components

USA . 850 parts In-Stock

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850

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Northwest PG Solutions

USA . 164 parts In-Stock

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164

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Overview

Upgrade your electronic projects with the 74VHC125TTR bus driver & transceiver from STMicroelectronics! With a reputation for quality and reliability, STMicroelectronics delivers top-notch products that meet the highest industry standards. Ideal for a wide range of applications, this versatile component offers fast propagation delay, low power consumption, and 3-state output characteristics. Increase efficiency and performance in your designs with the 74VHC125TTR - the perfect choice for demanding projects that require precision and speed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into compact electronic devices.

No. of Functions: 4

Having multiple functions in a single package enhances the product's versatility and functionality.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard supply voltage of 3.3V, making it compatible with a wide range of systems.

Power Supplies (V): 2/5.5

Supports a wide range of power supplies from 2V to 5.5V, increasing flexibility in system design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design with a small outline and thin profile saves space and allows for denser board layouts.

Maximum I (ol): 8 Amp

High output current capability of 8A ensures reliable and robust performance under heavy loads.

Output Characteristics: 3-STATE

3-state output allows for multiple output levels, offering flexibility in system control and signal routing.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold temperatures down to -55 °C, making it suitable for harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers 74VHC125TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC125TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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