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74VCXR162245TTR

STMicroelectronics

74VCXR162245TTR by STMicroelectronics

74VCXR162245TTR by STMicroelectronics is a dual 8-bit bus driver with a propagation delay of just 4 ns, ideal for high-speed data transmission. It operates b/w 1.8V and 3.6V, supporting up to 12A output current. Its compact design suits military applications requiring reliability in extreme temperatures (-55 °C to +125°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,048 parts In-Stock

1+ parts

-

100+ parts

-

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7,048

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-

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Digiode

USA . 3,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

3,306

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-

-

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Anansix

USA . 1,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 196 parts In-Stock

1+ parts

$4.511

100+ parts

-

1k+ parts

$4.330

10k+ parts

$4.330

196

$4.511

-

$4.330

$4.330

AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$20.940

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$20.940

-

-

-

IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$29.278

100+ parts

-

1k+ parts

$26.350

10k+ parts

-

604

$29.278

-

$26.350

-

Microchip USA

USA . 273 parts In-Stock

1+ parts

$40.545

100+ parts

-

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-

10k+ parts

-

273

$40.545

-

-

-

Ampacity Inc.

Singapore . 1,007 parts In-Stock

1+ parts

$44.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$44.000

-

-

-

MKK Technologies

India . 1,839 parts In-Stock

1+ parts

$55.056

100+ parts

-

1k+ parts

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10k+ parts

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1,839

$55.056

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DigiPath Technology Company

USA . 1,839 parts In-Stock

1+ parts

$55.056

100+ parts

-

1k+ parts

-

10k+ parts

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1,839

$55.056

-

-

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Component Stockers USA

USA . 731 parts In-Stock

1+ parts

$99.990

100+ parts

-

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731

$99.990

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-

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Parana Technologies

USA . 1,884 parts In-Stock

1+ parts

-

100+ parts

$35.006

1k+ parts

-

10k+ parts

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1,884

-

$35.006

-

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Northwest PG Solutions

USA . 1,066 parts In-Stock

1+ parts

-

100+ parts

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1,066

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Native Components

USA . 968 parts In-Stock

1+ parts

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968

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Corphita

USA . 846 parts In-Stock

1+ parts

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846

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Overview

Elevate your designs with the 74VCXR162245TTR from STMicroelectronics, a premier choice in bus drivers and transceivers. This high-performance component ensures rapid data transfer with minimal delay, all within a compact, robust package. Renowned for quality and reliability, STMicroelectronics offers unmatched durability, making it ideal for automotive and industrial applications. Experience seamless integration and exceptional efficiency that drive innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures protection against environmental factors, adding to the reliability of the product.

Propagation Delay At Nominal Supply: 4 ns

A low propagation delay enhances performance in high-speed applications, making this bus driver/transceiver suitable for demanding tasks.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, optimizing space on the PCB.

No. of Functions: 2

Offering dual functionality increases versatility and utility in various circuit designs, saving space and costs.

Package Shape: RECTANGULAR

The rectangular shape is ideal for space efficiency and easy integration into various configurations.

No. of Bits: 8

An 8-bit architecture permits efficient data handling and communication, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V aligns with modern low-power systems, making it ideal for energy-sensitive applications.

Load Capacitance (CL): 30 pF

A low load capacitance enhances switching speed and minimizes signal distortion in high-frequency applications.

Power Supplies (V): 3.3

Compatibility with 3.3V power supplies ensures it can be easily integrated into a variety of current technologies.

No. of Terminals: 48

Having 48 terminals allows for extensive connectivity options, ideal for larger and more complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate space-saving designs while maintaining high performance.

Maximum I (ol): 12 Amp

A maximum output current of 12 Amps enables the handling of robust loads, suitable for high-power applications.

Propagation Delay (tpd): 6.5 ns

A propagation delay of 6.5 ns contributes to quick response times, crucial for high-speed data transfer.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures makes this device reliable for environments with extreme thermal conditions.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output facilitates flexible signal management and allows multiple bus connections without interference.

Minimum Operating Temperature: -55 °C

Operating in extreme cold ensures reliability in challenging environments, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium nickel-palladium-gold finish enhances durability and prevents corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and facilitates easier PCB design.

No. of Ports: 2

Providing two ports allows for efficient communication between multiple devices, improving overall system performance.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact build, making it suitable for modern, space-constrained applications.

Width: 6.1 mm

The compact width allows for denser circuit board layouts, optimizing use of available space.

Output Polarity: TRUE

True output polarity provides predictable behavior in logic circuits, enhancing design simplicity.

Minimum Supply Voltage (Vsup): 1.8 V

Operating with a minimum supply voltage of 1.8V allows for energy-efficient designs, helping to reduce overall power consumption.

Length: 12.5 mm

The compact length supports integration into a range of applications, making it suitable for both consumer and industrial devices.

Temperature Grade: MILITARY

Designed to meet military standards, this product ensures reliability in high-stakes situations or extreme environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, vital for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance reliability during PCB assembly.

Packing Method: TR

Tape and reel packing method simplifies inventory management and ease of use during assembly.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for compact soldering and efficient use of PCB space.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability enhances flexibility in communication protocols, especially in multi-device configurations.

Control Type: COMMON CONTROL

Common control type simplifies the design and integration process, making it easier to implement in various systems.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of electronic systems and applications.

Technical Specifications

Bus Driver & Transceivers 74VCXR162245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74VCXR162245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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