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74VCXH1632245TTR

STMicroelectronics

74VCXH1632245TTR by STMicroelectronics

74VCXH1632245TTR by STMicroelectronics is a 16-bit bus driver with a propagation delay of just 5.8 ns, supporting voltage translation b/w 1.8V and 3.3V. It features a compact SO package and operates in industrial temperatures from -40 °C to 85 °C, ideal for high-speed data applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,390 parts In-Stock

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5,390

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Digiode

USA . 1,977 parts In-Stock

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1,977

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Anansix

USA . 958 parts In-Stock

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958

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Distributors (Availability)

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Andel Nordic

Denmark . 274 parts In-Stock

1+ parts

$3.293

100+ parts

-

1k+ parts

$3.161

10k+ parts

$3.161

274

$3.293

-

$3.161

$3.161

Native Components

USA . 464 parts In-Stock

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$7.047

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464

$7.047

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

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$8.811

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-

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$7.930

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1,040

$8.811

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$7.930

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AZTECH Wire

Italy . 1,132 parts In-Stock

1+ parts

$10.020

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1,132

$10.020

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MKK Technologies

India . 1,608 parts In-Stock

1+ parts

$16.568

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1,608

$16.568

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DigiPath Technology Company

USA . 1,608 parts In-Stock

1+ parts

$16.568

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1,608

$16.568

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Microchip USA

USA . 265 parts In-Stock

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$28.422

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265

$28.422

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Northwest PG Solutions

USA . 1,813 parts In-Stock

1+ parts

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$6.906

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1,813

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$6.906

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Corphita

USA . 1,527 parts In-Stock

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1,527

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Parana Technologies

USA . 458 parts In-Stock

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$10.535

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458

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$10.535

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Overview

Elevate your designs with the 74VCXH1632245TTR from STMicroelectronics—a premier bus driver and transceiver solution that combines reliability with exceptional performance. This high-quality component supports multiple voltage levels, ensuring seamless communication across devices in various applications, from consumer electronics to industrial automation. With its ultra-fast propagation delay and robust thermal performance, you gain efficiency and longevity, empowering your projects to thrive in demanding environments. Choose STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure reliability and longevity in various applications.

Propagation Delay At Nominal Supply: 5.8 ns

Low propagation delay enhances speed and performance in high-frequency applications.

Surface Mount: YES

Surface mount technology provides a compact footprint, ideal for space-constrained designs.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient PCB layout and space utilization.

No. of Bits: 16

Support for 16 bits enables the handling of larger data sets for applications requiring wide data buses.

Translation: 1.8/2.5V & 3.3V

Versatile voltage translation allows compatibility with various logic levels, enhancing integration flexibility.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V balances power consumption with performance.

Load Capacitance (CL): 30 pF

Low load capacitance minimizes signal distortion and enhances switching speeds.

Power Supplies (V): 1.8/2.5,2.5/3.3

Support for multiple power supply options improves versatility for different application requirements.

No. of Terminals: 48

A higher number of terminals provides more connections for complex applications, improving functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch help save space on PCBs, allowing for more compact designs.

Maximum I (ol): 6 Amp

High output current capability supports demanding applications that require robust signal handling.

Propagation Delay (tpd): 6.2 ns

Fast propagation delay ensures quicker response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

Operates in high-temperature environments, making it suitable for industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output enhances bus control and reduces signal contention in multi-device interfaces.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves solderability and enhances conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB design and layout for optimal connectivity.

No. of Ports: 2

Dual ports enable simultaneous data transfer in both directions, enhancing data throughput.

Maximum Seated Height: 1.2 mm

Low seated height allows for low-profile designs, ideal for space-constrained applications.

Width: 6.1 mm

Compact width helps in designing denser PCB layouts without compromising performance.

Output Polarity: TRUE

True output polarity ensures predictable behavior in circuits, simplifying design considerations.

Minimum Supply Voltage (Vsup): 2.3 V

Low minimum supply voltage enables operation in battery-powered devices, enhancing energy efficiency.

Length: 12.5 mm

Compact length contributes to space-saving designs on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easier to solder, improving assembly reliability.

Packing Method: TR

Tape and reel packing method supports automated assembly and reduces handling damage.

Terminal Pitch: 0.5 mm

Fine pitch allows high-density designs, suitable for modern, compact electronic devices.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances communication and control in multi-device systems.

Control Type: COMMON CONTROL

Common control simplifies the design of complex multi-device systems.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage expands the range of compatible applications, allowing for diverse use cases.

Technical Specifications

Bus Driver & Transceivers 74VCXH1632245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

16

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

1.8/2.5,2.5/3.3

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

1.8/2.5V&3.3V

Width:

6.1 mm

Trade Compliance

74VCXH1632245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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