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74LVX541TTR

STMicroelectronics

74LVX541TTR by STMicroelectronics

74LVX541TTR from STMicroelectronics is an 8-bit bus driver with a propagation delay of just 12 ns, operating at a supply voltage of 2.7-3.6 V. It features a compact SOIC package and supports true output polarity, ideal for high-speed data transmission in military applications. With a max temp of 125 °C, it ensures reliability in demanding environments.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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DigiKey

USA . 167 parts In-Stock

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Digiode

USA . 686 parts In-Stock

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$1.168

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Vyrian

USA . 3,003 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,400 parts In-Stock

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Anansix

USA . 556 parts In-Stock

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Bristol Electronics

USA . 129 parts In-Stock

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$0.317

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Sogenti Electronics

Canada . 50 parts In-Stock

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Speed Components Ltd

Israel . 25 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 528 parts In-Stock

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$0.846

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Corphita

USA . 4,491 parts In-Stock

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$1.107

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Microchip USA

USA . 313 parts In-Stock

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$10.998

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$14.320

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$13.031

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$11.742

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$13.031

$11.742

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IDEA Electronic Components Group

UK . 1,568 parts In-Stock

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$17.276

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$15.548

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MKK Technologies

India . 2,186 parts In-Stock

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$32.486

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DigiPath Technology Company

USA . 2,186 parts In-Stock

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$32.486

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Component Stockers USA

USA . 502 parts In-Stock

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$99.990

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Perfect Parts

USA . 27,666 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 1,989 parts In-Stock

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Northwest PG Solutions

USA . 1,459 parts In-Stock

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Native Components

USA . 100 parts In-Stock

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Overview

Elevate your designs with the 74LVX541TTR from STMicroelectronics, a robust solution for seamless data transmission. Crafted with precision and backed by a trusted manufacturer, this bus driver excels in reliability and performance across diverse applications—from automotive to industrial systems. Enjoy enhanced efficiency and lower power consumption while ensuring optimal heat resistance. Choose the 74LVX541TTR for superior quality that empowers your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection from environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 12 ns

A low propagation delay ensures quick signal transmission, enhancing the overall speed of data communication in systems.

Surface Mount: YES

Being surface mount compatible allows for easier integration onto PCBs, saving space and streamlining assembly processes.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient layout on circuit boards, enabling optimal use of space.

No. of Bits: 8

An 8-bit bus driver allows for substantial data handling capabilities in digital applications, supporting various data transfer tasks.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V is ideal for low-power applications, reducing overall energy consumption.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, this product fits well into modern digital systems, ensuring widespread usability.

No. of Terminals: 20

With 20 terminals, the device provides flexibility in connections and increased functionality in circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate compact designs while the shrink pitch enhances component density on PCBs.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp allows this driver to handle heavy loads, making it suitable for demanding applications.

Propagation Delay (tpd): 15 ns

With a propagation delay of 15 ns, this component supports high-speed digital communications, adding to its efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in extreme conditions, suitable for military and industrial use.

Output Characteristics: 3-STATE

3-state output characteristics provide versatility in managing multiple signals on a bus, improving data management.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C makes this device reliable in harsh environments, catering to military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish offers excellent solderability and corrosion resistance, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible design choices in mounting, enhancing connectivity options.

No. of Ports: 2

Having 2 ports enables simultaneous communication pathways, aiding in effective data distribution.

Maximum Seated Height: 1.2 mm

A low maximum seated height contributes to a thinner PCB profile, ideal for compact electronic devices.

Width: 4.4 mm

The compact width helps to save space on PCBs, allowing for more efficient design layouts.

Output Polarity: TRUE

True output polarity simplifies circuit design and ensures straightforward logic in signaling.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V ensures compatibility with a range of low-voltage systems, promoting energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum reflow time of 40 seconds allows for effective solder joint formation during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures robustness during assembly and compatibility with lead-free soldering processes.

Length: 6.5 mm

At 6.5 mm in length, this product is compact, facilitating integration into space-constrained electronic systems.

Temperature Grade: MILITARY

The military temperature grade guarantees performance in extreme conditions, making it suitable for rugged applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing overall circuit performance.

Terminal Form: GULL WING

Gull wing terminals offer superior mechanical strength and reliability, ensuring long-lasting connections.

Packing Method: TR

Tape and reel packing enables automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for higher density and compact PCB designs, accommodating modern electronic needs.

Control Type: ENABLE LOW

The low enable control type streamlines activation processes, simplifying circuit design and reducing complexity.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding appropriate handling and storage practices.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V provides flexibility in design, accommodating a variety of system requirements.

Technical Specifications

Bus Driver & Transceivers 74LVX541TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74LVX541TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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