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74LVX373MTR

STMicroelectronics

74LVX373MTR by STMicroelectronics

74LVX373MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 16 ns and operates at a supply voltage of 2.7-3.6 V. Its compact design features a dual terminal layout, ideal for military applications. This CMOS device supports high-speed data transfer in space-constrained environments.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 8,733 parts In-Stock

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Anansix

USA . 2,318 parts In-Stock

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PC Components Company LLC

USA . 1,167 parts In-Stock

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Bristol Electronics

USA . 1,167 parts In-Stock

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Digiode

USA . 1,036 parts In-Stock

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Distributors (Availability)

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Northwest PG Solutions

USA . 775 parts In-Stock

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$3.344

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775

$3.344

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Andel Nordic

Denmark . 200 parts In-Stock

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$3.678

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$3.531

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$3.531

200

$3.678

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$3.531

$3.531

IDEA Electronic Components Group

UK . 129 parts In-Stock

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$16.255

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$14.629

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129

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$14.629

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AZTECH Wire

Italy . 393 parts In-Stock

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$20.340

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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$21.093

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MKK Technologies

India . 426 parts In-Stock

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$30.566

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DigiPath Technology Company

USA . 426 parts In-Stock

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$30.566

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Component Stockers USA

USA . 428 parts In-Stock

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$99.990

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Microchip USA

USA . 7,057 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,265 parts In-Stock

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Parana Technologies

USA . 346 parts In-Stock

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$19.435

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Native Components

USA . 47 parts In-Stock

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$2.949

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$2.949

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Overview

Unlock the full potential of your designs with the 74LVX373MTR from STMicroelectronics, renowned for its unrivaled quality and innovation. This versatile bus driver and transceiver excels in a wide range of applications, offering rapid signal processing and reliable performance even in demanding environments. With ST's commitment to excellence, you gain peace of mind along with superior power efficiency, making it an ideal choice for enhancing your projects. Experience seamless integration and lasting durability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 16 ns

This low propagation delay enhances the speed of data transmission, making it a reliable choice for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly in automated production environments.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient board space utilization in compact circuit designs.

No. of Bits: 8

With 8 bits, this product can handle a byte of data, making it suitable for various digital communication and data processing applications.

Nominal Supply Voltage / Vsup (V): 2.7

A nominal supply voltage of 2.7V ensures compatibility with a wide range of modern digital devices and ICs.

Load Capacitance (CL): 50 pF

The manageable load capacitance allows for efficient signal integrity and performance in bus-based systems.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with many standard IC components in digital circuits, ensuring versatile usage.

No. of Terminals: 20

With 20 terminals, this device allows for multiple connection points, facilitating more complex circuit integrations.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on printed circuit boards, making it a smart choice for compact electronic designs.

Maximum I (ol): 4 Amp

A maximum output current of 4A allows the device to drive larger loads, making it powerful for demanding applications.

Propagation Delay (tpd): 22 ns

The propagation delay of 22 ns is advantageous for applications where timing is crucial, ensuring reliable performance.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes this device suitable for rugged and high-temperature environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance flexibility in bus communication applications by allowing multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55 °C expands its usability in extreme conditions, ensuring reliability in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and enhanced solderability, ensuring long-term reliability.

Terminal Position: DUAL

Dual-terminal configuration allows for easier integration into various circuit designs, enhancing design versatility.

No. of Ports: 2

Having 2 ports allows for bi-directional communication, making it efficient for data transfer between devices.

Maximum Seated Height: 2.65 mm

The low profile of 2.65 mm aids in compact PCB designs, making it suitable for space-constrained applications.

Width: 7.5 mm

The width of 7.5 mm supports efficient layout designs while maintaining circuit functionality, ideal for modern PCB designs.

Output Polarity: TRUE

TRUE output polarity simplifies interfacing with many logic families, ensuring compatibility across various components.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows for operation in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand up to 30 seconds at peak reflow temperature aids in compatibility with modern soldering techniques.

Peak Reflow Temperature °C: 260

Withstand reflow temperatures up to 260 °C ensures this device can handle professional manufacturing processes with ease.

Length: 12.8 mm

The compact length of 12.8 mm is ideal for fitting within tight spaces in dense electronic assemblies.

Temperature Grade: MILITARY

Military grade components ensure durability and reliability under extreme conditions, suitable for defense applications.

Technology: CMOS

CMOS technology offers low power consumption, making it an ideal choice for battery-operated and energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering performance and stability on the PCB, improving manufacturing yield.

Packing Method: TR

Tape and reel (TR) packaging method facilitates automated assembly, streamlining production processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm balances compactness with ease of soldering, enhancing usability in various designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows for flexibility in voltage supply choices while ensuring optimal performance.

Technical Specifications

Bus Driver & Transceivers 74LVX373MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74LVX373MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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