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74LVX244TTR

STMicroelectronics

74LVX244TTR by STMicroelectronics

74LVX244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 13 ns and operates at supply voltages from 2 to 3.6 V. It features dual ports, supporting up to 4 A output current, ideal for high-speed data transmission in compact applications. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 13,130 parts In-Stock

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13,130

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 4,353 parts In-Stock

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4,353

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Bristol Electronics

USA . 3,240 parts In-Stock

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3,240

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Dan-Mar Components

USA . 3,240 parts In-Stock

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3,240

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Anansix

USA . 2,829 parts In-Stock

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2,829

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ACDS - Activité Composants Distribution Service

France . 740 parts In-Stock

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740

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Digiode

USA . 385 parts In-Stock

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385

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Distributors (Availability)

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Andel Nordic

Denmark . 4,860 parts In-Stock

1+ parts

$3.328

100+ parts

-

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$3.195

10k+ parts

$3.195

4,860

$3.328

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$3.195

$3.195

Corohmni

South Africa . 156 parts In-Stock

1+ parts

$8.900

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156

$8.900

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Microchip USA

USA . 371 parts In-Stock

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$10.066

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371

$10.066

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AZTECH Wire

Italy . 476 parts In-Stock

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$13.610

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476

$13.610

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$20.084

100+ parts

$18.276

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$16.469

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1,000

$20.084

$18.276

$16.469

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IDEA Electronic Components Group

UK . 1,194 parts In-Stock

1+ parts

$26.076

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$23.468

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1,194

$26.076

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$23.468

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MKK Technologies

India . 159 parts In-Stock

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$49.033

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159

$49.033

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DigiPath Technology Company

USA . 159 parts In-Stock

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$49.033

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159

$49.033

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Component Stockers USA

USA . 599 parts In-Stock

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$99.990

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599

$99.990

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Perfect Parts

USA . 36,506 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,689 parts In-Stock

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Kepictronics

USA . 11,404 parts In-Stock

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Metaverse IC Inc.

Canada . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,299 parts In-Stock

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6,299

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Northwest PG Solutions

USA . 1,343 parts In-Stock

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1,343

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Corphita

USA . 878 parts In-Stock

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878

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Parana Technologies

USA . 787 parts In-Stock

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$31.177

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787

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$31.177

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Native Components

USA . 139 parts In-Stock

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139

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Overview

Unlock unparalleled performance with the 74LVX244TTR from STMicroelectronics, renowned for its excellence in digital circuits. This high-quality bus driver and transceiver enhance data communication reliability, boasting rapid propagation delays that optimize your designs. Perfect for automotive and industrial applications, it promises durability even in extreme conditions, providing you with unmatched value and peace of mind. Elevate your projects with STMicro’s trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures the longevity and performance of the device in various applications.

Propagation Delay At Nominal Supply: 13 ns

A low propagation delay contributes to high-speed data transmission, making this product suitable for fast communication systems.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating efficient space utilization on PCBs.

No. of Functions: 2

Increased functionality in a single package reduces components needed, simplifying designs and saving space.

Package Shape: RECTANGULAR

The rectangular shape is standard and easily integrates into various circuit designs.

No. of Bits: 4

Supports 4-bit data paths, making it suitable for a variety of digital applications.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage is optimal for modern low-power applications, ensuring efficient operation.

Load Capacitance (CL): 50 pF

This low load capacitance allows for faster switching speeds, enhancing performance in communication applications.

Power Supplies (V): 3.3

3.3V compatibility makes this device suitable for many standard logic applications.

No. of Terminals: 20

20 terminals provide ample connectivity options for diverse applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style promotes efficient thermal and electrical performance while conserving space.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps allows for robust performance in power-hungry applications.

Propagation Delay (tpd): 18 ns

Fast propagation delay ensures timely data processing and minimal latency, crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates reliability in extreme environments.

Output Characteristics: 3-STATE

3-state output enables multiple devices to connect on the same bus, enhancing system versatility.

Minimum Operating Temperature: -55 °C

A wide operating temperature range ensures this product is suitable for harsh environments, including military use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality finish provides excellent conductivity and corrosion resistance, enhancing reliability.

Terminal Position: DUAL

Dual terminal positions facilitate versatile design options and ease of integration into different circuits.

No. of Ports: 2

Supporting two ports provides better connectivity options for communication networks.

Maximum Seated Height: 1.2 mm

A low profile height enables tighter packaging and integration into compact electronic devices.

Width: 4.4 mm

A narrow width allows for efficient use in dense PCB layouts while maintaining performance.

Output Polarity: TRUE

True output polarity simplifies design considerations for certain applications.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate down to 2V enhances versatility in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures compatibility with standard soldering processes, promoting manufacturability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance indicates reliability in soldering assembly processes.

Length: 6.5 mm

A compact length enables integration into space-constrained applications, promoting design flexibility.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure operation in extreme conditions, making it suitable for defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing overall system reliability.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling during assembly and strong mechanical stability.

Packing Method: TR

Tape and reel packing simplifies automated assembly processes, improving production efficiency.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density designs, maximizing PCB real estate.

Control Type: ENABLE LOW

Low-enable control ensures compatibility with various logic families and simplifies control circuitry.

Moisture Sensitivity Level (MSL): 3

MSL 3 signifies that the product requires moisture-sensitive handling, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 3.6 V

Allows for flexibility in application, accommodating various system requirements.

Technical Specifications

Bus Driver & Transceivers 74LVX244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74LVX244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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