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74LVX20TTR

STMicroelectronics

74LVX20TTR by STMicroelectronics

74LVX20TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11 ns, operating at a nominal voltage of 3.3V. It features dual functions and supports up to 4 inputs, making it ideal for compact electronic applications. Its robust design ensures reliability in military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,581 parts In-Stock

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Anansix

USA . 973 parts In-Stock

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973

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Digiode

USA . 167 parts In-Stock

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167

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Distributors (Availability)

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$14.350

100+ parts

$13.059

1k+ parts

$11.767

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-

20

$14.350

$13.059

$11.767

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AZTECH Wire

Italy . 494 parts In-Stock

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$17.010

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494

$17.010

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Microchip USA

USA . 406 parts In-Stock

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$17.814

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406

$17.814

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IDEA Electronic Components Group

UK . 392 parts In-Stock

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$25.947

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$23.352

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392

$25.947

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$23.352

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Corohmni

South Africa . 501 parts In-Stock

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$32.331

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501

$32.331

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MKK Technologies

India . 608 parts In-Stock

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$48.791

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$48.791

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DigiPath Technology Company

USA . 608 parts In-Stock

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$48.791

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Component Stockers USA

USA . 636 parts In-Stock

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$99.990

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$99.990

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Native Components

USA . 656 parts In-Stock

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$144.900

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$139.104

656

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$139.104

Northwest PG Solutions

USA . 830 parts In-Stock

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$159.390

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$159.390

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Corphita

USA . 3,915 parts In-Stock

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Parana Technologies

USA . 75 parts In-Stock

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$31.023

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$31.023

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Overview

Unlock the power of innovation with the 74LVX20TTR from STMicroelectronics! Renowned for its exceptional quality and reliability, this CMOS logic gate is designed to enhance your electronic designs with remarkable speed and efficiency. Its compact, thin profile allows for seamless integration into a variety of applications, from consumer electronics to automotive systems. Experience unparalleled performance and longevity, ensuring your projects thrive in any environment!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures robustness and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay allows for fast signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability simplifies PCB design and allows for high-density mounting, saving space in applications.

No. of Functions: 2

Multiple functions in one package enhance versatility and reduce the number of components needed on a board.

No. of Inputs: 4

With 4 inputs, this logic gate can handle multiple signal inputs, enhancing its functionality in complex circuits.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of space on PCB layouts, making design more streamlined.

Nominal Supply Voltage / Vsup (V): 3.3

Designed for a nominal supply voltage of 3.3V, this gate is ideal for low-power applications.

Load Capacitance (CL): 50 pF

The low load capacitance enables faster switching speeds, which is crucial for high-speed digital circuits.

Power Supplies (V): 3.3

Operating at a standard 3.3V supply makes it compatible with many modern electronic devices.

No. of Terminals: 14

With 14 terminals, it provides ample connection points for complex integrations in circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline package minimizes space requirements and is optimal for compact designs.

Maximum I (ol): 4 Amp

A high output current capability of 4 Amps allows this logic gate to drive larger loads efficiently.

Propagation Delay (tpd): 16.4 ns

Although slightly higher than the nominal delay, this propagation delay is still suitable for many applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for use in demanding environments without failure.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures functionality in extreme temperature conditions, making it reliable.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit designs and enhances layout versatility.

Maximum Seated Height: 1.2 mm

A low seated height allows for slim-profile designs, making it easier to fit into compact spaces.

Width: 4.4 mm

The narrow width allows for more efficient use of space on boards while fitting into tight designs.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this logic gate operates well within the lower voltage range of digital circuits.

Length: 5 mm

The compact length aids in fitting more components into a limited space on PCBs.

Temperature Grade: MILITARY

MIL-STD qualifications ensure that this product is built for durability and reliability in harsh conditions.

Technology: CMOS

CMOS technology guarantees low-power operation and high noise immunity, essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide efficient surface mounting and reliable electrical connections.

Packing Method: TR

Tape and reel packaging makes it convenient for automated assembly processes.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is advantageous for minimizing space on PCBs while maintaining soldering accuracy.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows for compatibility with a wide range of devices requiring higher voltage levels.

Technical Specifications

Logic Gates 74LVX20TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVX20TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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