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74LVX138MTR

STMicroelectronics

74LVX138MTR by STMicroelectronics

74LVX138MTR by STMicroelectronics is a CMOS decoder/driver with a propagation delay of just 15 ns and operates at supply voltages b/w 2-3.6 V. It features a compact SO package, ideal for space-constrained applications. This device supports military-grade temperature ranges from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,992 parts In-Stock

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Digiode

USA . 3,435 parts In-Stock

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3,435

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Anansix

USA . 1,577 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 230 parts In-Stock

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Microchip USA

USA . 373 parts In-Stock

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$0.330

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373

$0.330

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$9.511

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$8.560

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837

$9.511

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$8.560

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AZTECH Wire

Italy . 641 parts In-Stock

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$10.040

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641

$10.040

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MKK Technologies

India . 1,231 parts In-Stock

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$17.885

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$17.885

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Corphita

USA . 2,451 parts In-Stock

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Northwest PG Solutions

USA . 2,051 parts In-Stock

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Parana Technologies

USA . 1,949 parts In-Stock

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$11.372

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Native Components

USA . 523 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 230 parts In-Stock

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Glotronic Ltd.

UK . 184 parts In-Stock

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Overview

Elevate your designs with the 74LVX138MTR from STMicroelectronics—an industry leader renowned for exceptional quality and innovation. This high-performance decoder promises rapid response times, making it ideal for applications in communication systems, automotive electronics, and industrial automation. Enjoy enhanced reliability and efficiency with a robust temperature range and surface mount flexibility, ensuring seamless integration into your projects. Trust in STMicroelectronics to deliver value that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various environments.

Propagation Delay At Nominal Supply: 15 ns

Fast propagation delay allows for high-speed circuit applications, enhancing overall system performance.

Surface Mount: YES

Surface mount capability facilitates compact designs and automated assembly processes.

Input Conditioning: STANDARD

Standard input conditioning meets common design requirements for versatility in applications.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of PCB space and simplifies layout design.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage ensures compatibility with a wide range of devices and low power consumption.

Power Supplies (V): 3.3

Standard power supply level, common in many electronic systems, making integration easier.

No. of Terminals: 16

Adequate number of terminals allows for multiple connections, enhancing functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package allows for space-saving designs, ideal for compact electronic devices.

Maximum I (ol): 4 Amp

High output current capability ensures performance in demanding applications without overheating.

Propagation Delay (tpd): 22 ns

Acceptable propagation delay supports fast switching applications, maintaining efficiency.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes this product suitable for demanding industrial and military applications.

Minimum Operating Temperature: -55 °C

Low temperature range ensures operation in extreme environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Robust terminal finish ensures excellent solderability and corrosion resistance.

Terminal Position: DUAL

Dual terminal position facilitates flexible PCB layout and enhances connectivity options.

Maximum Seated Height: 1.75 mm

Low seated height ensures compatibility with low-profile designs, contributing to overall design efficiency.

Width: 3.9 mm

Compact width allows for dense electronic assemblies and efficient use of board space.

Output Polarity: INVERTED

Inverted output polarity is useful for specific applications requiring such functionality.

Minimum Supply Voltage (Vsup): 2 V

Lower supply voltage allows for compatibility with low-power battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

Robust reflow specifications ensure reliable assembly in manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports advanced soldering techniques.

Length: 9.9 mm

Compact length contributes to space-efficient electronic designs.

Temperature Grade: MILITARY

Military-grade specifications ensure reliability in critical and harsh environment applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a smart choice for modern designs.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical support and ease of handling during PCB assembly.

Packing Method: TR

Tape and reel packing simplifies automated assembly processes and enhances manufacturing efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with common PCB layouts and facilitates easy soldering.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level allows for practical storage and handling in a variety of environments.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a wide range of supply voltages, providing flexibility for different application designs.

Technical Specifications

Decoder & Drivers 74LVX138MTR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LVX138MTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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