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74LVX08MTR

STMicroelectronics

74LVX08MTR by STMicroelectronics

74LVX08MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 13 ns and operates at supply voltages from 2 to 3.6 V. It features four functions with dual inputs, ideal for compact electronic applications. Its military-grade design ensures reliability in extreme temperatures (-55 °C to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 6,433 parts In-Stock

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6,433

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Digiode

USA . 4,389 parts In-Stock

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4,389

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ComSIT Distribution GmbH

Germany . 1,792 parts In-Stock

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1,792

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Anansix

USA . 829 parts In-Stock

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829

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Distributors (Availability)

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Microchip USA

USA . 345 parts In-Stock

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$0.447

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345

$0.447

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IDEA Electronic Components Group

UK . 2,038 parts In-Stock

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$12.102

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$10.892

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2,038

$12.102

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$10.892

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AZTECH Wire

Italy . 440 parts In-Stock

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$17.890

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440

$17.890

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MKK Technologies

India . 2,091 parts In-Stock

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$22.756

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$22.756

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DigiPath Technology Company

USA . 2,091 parts In-Stock

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$22.756

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$22.756

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Native Components

USA . 771 parts In-Stock

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$34.543

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$33.162

771

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$33.162

Northwest PG Solutions

USA . 114 parts In-Stock

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$37.998

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114

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Component Stockers USA

USA . 540 parts In-Stock

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$99.990

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540

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Perfect Parts

USA . 45,571 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 8,685 parts In-Stock

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Glotronic Ltd.

UK . 948 parts In-Stock

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Parana Technologies

USA . 626 parts In-Stock

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$14.469

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Corphita

USA . 277 parts In-Stock

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Overview

Unlock unparalleled performance with the 74LVX08MTR from STMicroelectronics—a trusted leader in innovation. This high-quality logic gate promises swift response times and exceptional reliability, ideal for demanding applications in automotive, industrial, and consumer electronics. With its compact design and military-grade durability, it seamlessly fits into your projects, ensuring efficiency and longevity. Elevate your designs and experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making it well-suited for various environments.

Propagation Delay At Nominal Supply: 13 ns

A fast propagation delay of 13 ns ensures quick signal processing, enhancing system performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

No. of Functions: 4

Having four functions increases versatility, allowing the product to perform multiple logical operations.

No. of Inputs: 2

With two inputs, the device is ideal for a variety of simple logic functions while maintaining a compact footprint.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on PCBs, facilitating high-density designs.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V is efficient for low-power applications, supporting battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance of 50 pF improves switching speed and overall circuit performance.

Power Supplies (V): 3.3

The compatibility with a 3.3V power supply is crucial for modern electronic circuits, ensuring reliability and efficiency.

No. of Terminals: 14

With 14 terminals, there are ample connection options available for versatile circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving designs, facilitating compact and lightweight electronics.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amp allows the device to drive high loads while maintaining performance.

Propagation Delay (tpd): 18 ns

This additional propagation delay specification allows for flexibility in more complex systems requiring slightly slower speeds.

Maximum Operating Temperature: 125 °C

The high operating temperature rating ensures reliability and performance in extreme conditions.

Minimum Operating Temperature: -55 °C

A wide temperature range makes this product suitable for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures long-term connectivity.

Terminal Position: DUAL

The dual terminal position allows for flexible design configurations on PCBs.

Maximum Seated Height: 1.75 mm

A low seated height is ideal for compact designs, helping to save space in tight environments.

Width: 3.9 mm

The narrow width allows for efficient use of board space, promoting high-density layouts.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate down to 2V expands the range of applications, especially in low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds accommodates various assembly processes, ensuring quality manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature is suitable for lead-free soldering processes, aligning with modern manufacturing standards.

Length: 8.65 mm

The compact length facilitates the integration of multiple components in limited spaces.

Temperature Grade: MILITARY

The military-grade temperature specification assures reliability in high-stress applications, such as defense and aerospace.

Technology: CMOS

Using CMOS technology allows for lower power consumption and increased chip density, making it ideal for modern electronics.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the PCB assembly process and improves solder joint strength.

Packing Method: TR

Tape and reel packing method provides efficient handling and automated assembly compatibility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard in many applications, ensuring compatibility with a range of PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

Ability to operate at a maximum supply voltage of 3.6V makes the product versatile for a variety of applications.

Technical Specifications

Logic Gates 74LVX08MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVX08MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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