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74LVC374AMTR

STMicroelectronics

74LVC374AMTR by STMicroelectronics

74LVC374AMTR by STMicroelectronics is an 8-bit bus driver with a 3.3V supply, featuring a fast propagation delay of 9.4 ns and robust output characteristics in a compact SO package. It operates in extreme temperatures from -55 °C to 125 °C, making it ideal for military applications. This CMOS device supports dual ports and offers true output polarity for reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,827 parts In-Stock

1+ parts

-

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7,827

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Digiode

USA . 3,802 parts In-Stock

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3,802

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Anansix

USA . 2,145 parts In-Stock

1+ parts

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2,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 429 parts In-Stock

1+ parts

$0.686

100+ parts

-

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-

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429

$0.686

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Andel Nordic

Denmark . 1,262 parts In-Stock

1+ parts

$4.154

100+ parts

-

1k+ parts

$3.988

10k+ parts

$3.988

1,262

$4.154

-

$3.988

$3.988

AZTECH Wire

Italy . 1,158 parts In-Stock

1+ parts

$13.550

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1,158

$13.550

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IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$18.547

100+ parts

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$16.692

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146

$18.547

-

$16.692

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MKK Technologies

India . 789 parts In-Stock

1+ parts

$34.877

100+ parts

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789

$34.877

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DigiPath Technology Company

USA . 789 parts In-Stock

1+ parts

$34.877

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789

$34.877

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Component Stockers USA

USA . 719 parts In-Stock

1+ parts

$99.990

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719

$99.990

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Native Components

USA . 497 parts In-Stock

1+ parts

$149.532

100+ parts

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$143.551

497

$149.532

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$143.551

Northwest PG Solutions

USA . 2,140 parts In-Stock

1+ parts

$164.485

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2,140

$164.485

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Corphita

USA . 2,157 parts In-Stock

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2,157

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Parana Technologies

USA . 1,178 parts In-Stock

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$22.176

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1,178

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$22.176

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Overview

Unlock the power of seamless data transfer with the 74LVC374AMTR from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers this reliable 8-bit bus driver, ideal for high-performance applications in automotive, industrial, and consumer electronics. Offering low propagation delay and versatile operating conditions, it ensures efficient communication while maximizing your design's potential. Elevate your projects with dependable technology that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and helps in protecting the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for easier and more compact circuit designs, facilitating high-density applications.

Package Shape: RECTANGULAR

Rectangular packages enable efficient use of PCB space, making them suitable for a wide range of applications.

No. of Bits: 8

An 8-bit configuration is ideal for various data processing tasks, providing a balance between performance and complexity.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V ensures compatibility with low-power systems, enhancing energy efficiency.

Power Supplies (V): 3.3

The ability to operate with a 3.3V power supply makes it versatile for common digital applications.

No. of Terminals: 20

With 20 terminals, this product offers multiple connection points, providing flexibility in system design.

Package Style (Meter): SMALL OUTLINE

A small outline package facilitates smaller circuit board requirements, making it suitable for compact electronics.

Maximum I (ol): 24 Amp

The capability to handle up to 24 Amps allows for robust performance in demanding applications.

Propagation Delay (tpd): 9.4 ns

A low propagation delay of 9.4 ns ensures high-speed operation, making it suitable for fast data transmission.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this component is suitable for high-temperature environments.

Output Characteristics: 3-STATE

3-state output characteristics enable flexible device communication and reduce power consumption.

Trigger Type: POSITIVE EDGE

Positive edge-triggering enhances synchronization with digital signals, ensuring reliable operation.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C ensures reliability in extreme conditions, making it suitable for military applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances solderability and reduces the risk of corrosion, improving long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for more versatile PCB layout options, enhancing design flexibility.

No. of Ports: 2

Having 2 ports allows for multi-channel operations and makes it suitable for a variety of applications.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm contributes to a compact design, essential for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm allows for efficient space management on PCBs without compromising on functionality.

Output Polarity: TRUE

True output polarity ensures compatibility with positive logic systems, providing usability in standard designs.

Minimum Supply Voltage (Vsup): 1.65 V

A minimum supply voltage of 1.65V enhances versatility, allowing integration into various low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow allows for effective soldering without damaging the component.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures reliable solder joint formation, crucial for long-lasting connections.

Length: 12.8 mm

With a length of 12.8 mm, it maintains a compact profile, making it suitable for high-density applications.

Temperature Grade: MILITARY

Rated for military temperature specifications, this product is designed for rugged and extreme environments.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides excellent mechanical stability and ease of soldering.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, increasing production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common and facilitates compatibility with existing PCB designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 means it can withstand the moisture exposure typical in industrial environments, ensuring reliability.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V allows integration into a broad range of circuits without performance issues.

Technical Specifications

Bus Driver & Transceivers 74LVC374AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

9.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74LVC374AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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