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74LVC373AMTR

STMicroelectronics

74LVC373AMTR by STMicroelectronics

74LVC373AMTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.2 ns, operating b/w 1.65V and 3.6V. It features a compact SO package and supports dual ports for efficient data transfer in military applications. Its robust design ensures reliable performance at temperatures from -55 °C to 125°C.

Median Price

$0.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 86 parts In-Stock

1+ parts

$0.520

100+ parts

$0.324

1k+ parts

-

10k+ parts

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86

$0.520

$0.324

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,188 parts In-Stock

1+ parts

$0.494

100+ parts

-

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-

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-

4,188

$0.494

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-

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Vyrian

USA . 5,114 parts In-Stock

1+ parts

-

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-

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5,114

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Anansix

USA . 1,039 parts In-Stock

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,126 parts In-Stock

1+ parts

$0.468

100+ parts

-

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-

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-

3,126

$0.468

-

-

-

IDEA Electronic Components Group

UK . 701 parts In-Stock

1+ parts

$8.016

100+ parts

-

1k+ parts

$7.214

10k+ parts

-

701

$8.016

-

$7.214

-

Corohmni

South Africa . 584 parts In-Stock

1+ parts

$9.476

100+ parts

-

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584

$9.476

-

-

-

Andel Nordic

Denmark . 2,452 parts In-Stock

1+ parts

$10.171

100+ parts

-

1k+ parts

$9.764

10k+ parts

$9.764

2,452

$10.171

-

$9.764

$9.764

Microchip USA

USA . 477 parts In-Stock

1+ parts

$12.358

100+ parts

-

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477

$12.358

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MKK Technologies

India . 964 parts In-Stock

1+ parts

$15.073

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-

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964

$15.073

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DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$15.073

100+ parts

-

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964

$15.073

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$22.783

100+ parts

$20.733

1k+ parts

$18.682

10k+ parts

-

3,000

$22.783

$20.733

$18.682

-

Native Components

USA . 148 parts In-Stock

1+ parts

$23.559

100+ parts

-

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148

$23.559

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Northwest PG Solutions

USA . 405 parts In-Stock

1+ parts

$25.915

100+ parts

$23.324

1k+ parts

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405

$25.915

$23.324

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Kepictronics

USA . 12,000 parts In-Stock

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12,000

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Perfect Parts

USA . 1,104 parts In-Stock

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1,104

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Parana Technologies

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$9.584

1k+ parts

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10k+ parts

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120

-

$9.584

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-

Overview

Elevate your designs with the 74LVC373AMTR from STMicroelectronics—an industry leader renowned for quality and reliability. This versatile bus driver enhances performance across diverse applications, delivering outstanding speed and efficiency in a compact package. With its robust construction and superior temperature tolerance, it ensures seamless operation in demanding environments, offering unmatched value and peace of mind for engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable construction material ensures longevity and resistance to environmental stress.

Propagation Delay At Nominal Supply: 8.2 ns

Fast propagation delay enhances data transmission speed, making the product suitable for high-performance applications.

Surface Mount: YES

Surface mount capability allows for compact and efficient designs, ideal for modern electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization on PCBs, allowing for more efficient circuit layouts.

No. of Bits: 8

Supports 8-bit data transfer, suitable for a variety of applications in digital communication.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal voltage of 2.7V balances performance and power consumption effectively.

Load Capacitance (CL): 50 pF

Low load capacitance facilitates faster switching and improves signal integrity in communication systems.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, increasing versatility in various electronic applications.

No. of Terminals: 20

20 terminals provide ample connectivity options for various input/output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style allows for high density and efficient use of board space.

Propagation Delay (tpd): 9.4 ns

Moderate propagation delay ensures quick data transfer, critical for high-speed applications.

Maximum Operating Temperature: 125 °C

High operating temperature range makes this device suitable for harsh environments in military applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus communication, allowing multiple devices to share a common bus.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme low temperatures ensures reliability in diverse applications and conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish improves solderability and long-term reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and simplifies assembly on PCBs.

No. of Ports: 2

Two ports facilitate communication in multi-channel applications, increasing versatility.

Maximum Seated Height: 2.65 mm

Low profile design minimizes space requirements, allowing for more compact device designs.

Width: 7.5 mm

Compact width aids in tight layout designs, making it ideal for space-constrained applications.

Output Polarity: TRUE

True output polarity simplifies design considerations for signal processing.

Minimum Supply Voltage (Vsup): 1.65 V

Supports low supply voltage operation, enhancing energy efficiency in battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time tolerance during peak reflow ensures reliable solder connections and component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature accommodates modern soldering processes, ensuring compatibility with automated assembly.

Length: 12.8 mm

Compact length fitting well in various design layouts, essential for miniaturized electronic products.

Temperature Grade: MILITARY

MIL-STD grade ensures robustness and reliability under severe conditions, making it suitable for military applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, ideal for modern applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the mechanical stability of the component.

Packing Method: TR

Tape and reel packing method simplifies automatic assembly processes, reducing manufacturing costs and time.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch is commonly used in many applications, enhancing compatibility with existing designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures the product’s reliability and long shelf-life when stored correctly.

Maximum Supply Voltage (Vsup): 3.6 V

Allows for a higher supply voltage range, providing flexibility in power supply design.

Technical Specifications

Bus Driver & Transceivers 74LVC373AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

9.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74LVC373AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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