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74LVC244AMTR

STMicroelectronics

74LVC244AMTR by STMicroelectronics

74LVC244AMTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 7.1 ns, operating b/w 1.65V and 3.6V. It features dual ports for efficient data transfer and supports up to 24A output current. Ideal for high-speed applications in military environments, it ensures reliable performance across extreme temperatures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,995 parts In-Stock

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4,995

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Vyrian

USA . 4,206 parts In-Stock

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4,206

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R&J Components

USA . 1,000 parts In-Stock

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1,000

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Anansix

USA . 769 parts In-Stock

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769

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Distributors (Availability)

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Andel Nordic

Denmark . 4,501 parts In-Stock

1+ parts

$2.603

100+ parts

-

1k+ parts

$2.499

10k+ parts

$2.499

4,501

$2.603

-

$2.499

$2.499

Native Components

USA . 729 parts In-Stock

1+ parts

$5.649

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-

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729

$5.649

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

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$13.718

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$12.346

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1,276

$13.718

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$12.346

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AZTECH Wire

Italy . 372 parts In-Stock

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$18.420

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372

$18.420

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MKK Technologies

India . 979 parts In-Stock

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$25.796

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979

$25.796

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DigiPath Technology Company

USA . 979 parts In-Stock

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$25.796

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979

$25.796

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Advanced Electronics

New Zealand . 164 parts In-Stock

1+ parts

$26.113

100+ parts

$25.852

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$24.807

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164

$26.113

$25.852

$24.807

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Kepictronics

USA . 76,000 parts In-Stock

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76,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Microchip USA

USA . 2,870 parts In-Stock

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2,870

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Corphita

USA . 1,066 parts In-Stock

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1,066

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Northwest PG Solutions

USA . 308 parts In-Stock

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$5.536

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308

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$5.536

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Parana Technologies

USA . 97 parts In-Stock

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$16.402

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97

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$16.402

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Overview

Elevate your designs with the 74LVC244AMTR from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This robust bus driver enhances system efficiency with impressive speed and versatility, making it ideal for automotive, industrial, and consumer applications. With superior temperature tolerance and reliability, experience seamless integration and exceptional performance that translates to long-term value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures reliability and longevity in demanding environments.

Propagation Delay At Nominal Supply: 7.1 ns

With a low propagation delay, this product enables fast signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier integration into modern electronics.

No. of Functions: 2

Offering dual functions enhances flexibility and reduces the need for additional components in your circuit design.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and simplifies layout design on PCBs.

No. of Bits: 4

This 4-bit configuration is optimal for applications requiring moderate data throughput without unnecessary complexity.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V strikes a balance between performance and power consumption.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, this product integrates seamlessly into modern digital systems.

No. of Terminals: 20

With 20 terminals, this device provides sufficient connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style allows for high-density circuit board layouts and saves space.

Maximum I (ol): 24 Amp

The high output current capability of 24A is ideal for driving heavy loads in various applications.

Propagation Delay (tpd): 12 ns

The propagation delay of 12ns ensures quick response times for fast switching applications.

Maximum Operating Temperature: 125 °C

Withstanding temperatures up to 125 °C makes this product highly reliable in harsh environments.

Output Characteristics: 3-STATE

3-state output capability provides flexibility in managing multiple bus systems without interference.

Minimum Operating Temperature: -55 °C

The capability to operate at temperatures as low as -55 °C supports a wide range of applications, including military and aerospace.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish enhances durability and ensures reliable electrical performance over time.

Terminal Position: DUAL

Dual terminal positioning facilitates easy placement in circuit boards, enabling versatile layouts.

No. of Ports: 2

Having 2 ports expands connectivity options, crucial for multi-device communication setups.

Maximum Seated Height: 2.65 mm

A low profile with a maximum seated height of 2.65mm is advantageous for space-constrained designs.

Width: 7.5 mm

At a width of 7.5mm, the component is compact and suitable for a variety of designs without taking up excessive board space.

Output Polarity: TRUE

True output polarity ensures that the component works optimally within its intended application environments.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a minimum supply voltage of 1.65V allows for greater flexibility in power supply design.

Length: 12.8 mm

The compact length of 12.8mm contributes to space efficiency in various electronic designs.

Temperature Grade: MILITARY

This product meets military-grade specifications, ensuring reliability and performance in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ideal for battery-powered and portable devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easier soldering and better mechanical stability on PCBs.

Packing Method: TR

Through-hole packaging supports automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm strikes a good balance between density and ease of handling during assembly.

Control Type: ENABLE LOW

The ENABLE LOW control type is straightforward to manage, making design integration simpler.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in application designs, allowing compatibility with various power levels.

Technical Specifications

Bus Driver & Transceivers 74LVC244AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.1 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74LVC244AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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