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74LVC04ATTR

STMicroelectronics

74LVC04ATTR by STMicroelectronics

74LVC04ATTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.5 ns, operating b/w 1.65V and 3.6V. It features six functions in a compact 14-terminal package, ideal for high-speed applications in military environments. Its robust design supports temperatures from -55 °C to 125°C, ensuring reliability.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,681 parts In-Stock

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8,681

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Digiode

USA . 2,589 parts In-Stock

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Anansix

USA . 2,056 parts In-Stock

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Microchip USA

USA . 435 parts In-Stock

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$8.450

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435

$8.450

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$10.721

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$9.756

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$8.791

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-

100

$10.721

$9.756

$8.791

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

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$16.705

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$15.035

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$16.705

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$15.035

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AZTECH Wire

Italy . 89 parts In-Stock

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$18.300

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89

$18.300

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MKK Technologies

India . 857 parts In-Stock

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$31.413

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$31.413

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DigiPath Technology Company

USA . 857 parts In-Stock

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$31.413

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$31.413

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Corohmni

South Africa . 138 parts In-Stock

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$33.276

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$33.276

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Component Stockers USA

USA . 271 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,826 parts In-Stock

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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Parana Technologies

USA . 2,163 parts In-Stock

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$19.974

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Corphita

USA . 1,809 parts In-Stock

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Northwest PG Solutions

USA . 1,366 parts In-Stock

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Native Components

USA . 274 parts In-Stock

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Overview

Unlock unparalleled performance with the 74LVC04ATTR from STMicroelectronics—a leader in innovative semiconductor solutions. This compact logic gate offers lightning-fast propagation delays and exceptional reliability across a vast temperature range, making it perfect for demanding applications in automotive, industrial, and consumer electronics. Experience improved efficiency and peace of mind as you harness the quality and durability that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 4.5 ns

A low propagation delay ensures quick signal processing, enhancing overall system performance and responsiveness in high-speed applications.

Surface Mount: YES

Supports surface mounting technology, enabling compact design and easy integration into modern circuit boards for effective space utilization.

No. of Functions: 6

With multiple functions, this logic gate can simplify circuit design, reducing component count and saving space in sophisticated applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout in circuit design and provides ease of assembly on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V provides flexibility in power supply options, contributing to battery-operated applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF is advantageous for high-speed operation without significant signal degradation.

Power Supplies (V): 3.3

Compatible with 3.3V power supplies, making it suitable for various digital circuits and systems.

No. of Terminals: 14

With 14 terminals, this gate allows for extensive connectivity options, suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate space-saving designs, ideal for modern electronics with limited real estate.

Maximum I (ol): 24 Amp

A high maximum output current of 24 Amp allows the gate to drive heavier loads, making it versatile for various applications.

Propagation Delay (tpd): 12.5 ns

Having a manageable propagation delay of 12.5 ns ensures that the logic gate supports high-speed performance in digital circuits.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

With a lower operational limit of -55 °C, this product is suitable for aerospace and military applications that experience extreme temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances reliability and reduces corrosion, ensuring long-term performance in various environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout, allowing for easier integration into different circuit configurations.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm supports low-profile designs, essential for slim electronic devices.

Width: 4.4 mm

A compact width of 4.4 mm aids in space-efficient PCB design, allowing for more functions in a smaller footprint.

Minimum Supply Voltage (Vsup): 1.65 V

The ability to operate with a minimum supply voltage of 1.65V allows for energy-efficient designs, particularly in battery-powered devices.

Length: 5 mm

A short length of 5 mm minimizes the space the component occupies on PCBs, contributing to more compact circuit designs.

Temperature Grade: MILITARY

The military-grade temperature classification ensures reliability and durability in harsh operating environments.

Technology: CMOS

Utilizing CMOS technology facilitates low power consumption and high noise immunity, making this gate suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and ensure reliable mechanical and electrical connections in surface mount applications.

Packing Method: TR

The taped and reeled packing method allows for automated assembly and efficient handling during manufacturing processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense packing of components on PCBs, maximizing design efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

Operating up to 3.6V allows for compatibility with a wide range of digital circuits, enhancing versatility.

Technical Specifications

Logic Gates 74LVC04ATTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74LVC04ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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