Loading...

74LVC04AMTR

STMicroelectronics

74LVC04AMTR by STMicroelectronics

74LVC04AMTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 4.5 ns and operates b/w 1.65V to 3.6V. It features six functions in a compact SO package, ideal for high-speed applications in military environments. With a max temp of 125 °C, it ensures reliability under extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,583

-

-

-

-

Digiode

USA . 4,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,088

-

-

-

-

Anansix

USA . 2,849 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,849

-

-

-

-

Prism Electronics

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 516 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

$0.163

516

$0.170

-

-

$0.163

Northwest PG Solutions

USA . 1,693 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

$0.165

1,693

$0.187

-

-

$0.165

Corohmni

South Africa . 273 parts In-Stock

1+ parts

$8.962

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$8.962

-

-

-

AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$15.940

100+ parts

-

1k+ parts

-

10k+ parts

-

771

$15.940

-

-

-

Microchip USA

USA . 200 parts In-Stock

1+ parts

$17.031

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$17.031

-

-

-

IDEA Electronic Components Group

UK . 731 parts In-Stock

1+ parts

$29.273

100+ parts

-

1k+ parts

$26.345

10k+ parts

-

731

$29.273

-

$26.345

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$30.922

100+ parts

$28.139

1k+ parts

$25.356

10k+ parts

-

5,000

$30.922

$28.139

$25.356

-

MKK Technologies

India . 1,916 parts In-Stock

1+ parts

$55.045

100+ parts

-

1k+ parts

-

10k+ parts

-

1,916

$55.045

-

-

-

DigiPath Technology Company

USA . 1,916 parts In-Stock

1+ parts

$55.045

100+ parts

-

1k+ parts

-

10k+ parts

-

1,916

$55.045

-

-

-

Component Stockers USA

USA . 514 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$99.990

-

-

-

Perfect Parts

USA . 6,218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,218

-

-

-

-

Corphita

USA . 3,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,632

-

-

-

-

Parana Technologies

USA . 1,122 parts In-Stock

1+ parts

-

100+ parts

$35.000

1k+ parts

-

10k+ parts

-

1,122

-

$35.000

-

-

GreenTree Electronics

Israel . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Overview

Unlock exceptional performance with the 74LVC04AMTR from STMicroelectronics. This robust logic gate ensures lightning-fast response times and unrivaled reliability, perfect for diverse applications in consumer electronics, automotive systems, and industrial automation. With STMicro's commitment to quality and innovation, you gain access to a high-performance solution that enhances efficiency while reducing power consumption. Elevate your designs today with trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances reliability and protection against environmental factors.

Propagation Delay At Nominal Supply: 4.5 ns

A low propagation delay ensures faster signal processing, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount technology allows for compact designs and easier integration into modern electronic circuits.

No. of Functions: 6

With six functions, this logic gate offers versatility, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape is standard and helps in easy placement on PCBs, optimizing design layouts.

Nominal Supply Voltage / Vsup: 2.7 V

Operating at a low nominal supply voltage contributes to energy efficiency in device operation.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures good performance in various applications while maintaining signal integrity.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, making it suitable for a wide range of applications.

No. of Terminals: 14

Fourteen terminals provide sufficient connectivity options for complex functionalities in circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs, enabling compact circuit designs.

Maximum I (ol): 24 Amp

A high output current rating of 24 Amps allows for driving larger loads, enhancing the component’s versatility.

Propagation Delay (tpd): 12.5 ns

This propagation delay value allows for adequate performance in medium-speed applications without significant losses.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures makes this component suitable for extreme and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish improves solderability and enhances the connection durability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design and component placement.

Maximum Seated Height: 1.75 mm

A compact seated height allows for more efficient use of vertical space on the PCB.

Width: 3.9 mm

A narrow width enables tighter component spacing, facilitating more complex circuit designs.

Minimum Supply Voltage (Vsup): 1.65 V

Operating down to 1.65V makes this component versatile for low-power applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum peak reflow time of 40 seconds ensures compatibility with common soldering processes.

Peak Reflow Temperature: 260 °C

This peak reflow temperature allows for effective soldering while minimizing potential damage to the component.

Length: 8.65 mm

The 8.65 mm length is standard for logic gates, facilitating easy integration into existing designs.

Temperature Grade: MILITARY

Military-grade certification ensures superior reliability and durability in critical applications.

Technology: CMOS

The CMOS technology allows for low power consumption and high noise immunity, ideal for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering.

Packing Method: TR

The tape and reel packing method ensures efficient handling and automated assembly processes.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm offers compatibility with many PCB layouts, simplifying design.

Maximum Supply Voltage (Vsup): 3.6 V

The capability to operate up to 3.6V provides flexibility, ensuring compatibility with a variety of systems.

Technical Specifications

Logic Gates 74LVC04AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LVC04AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20