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74LCXH16245TTR

STMicroelectronics

74LCXH16245TTR by STMicroelectronics

74LCXH16245TTR by STMicroelectronics is a high-speed bus driver with a propagation delay of just 5.3 ns, supporting dual ports and operating at 3.3V. It features a compact SO package and operates in extreme temperatures from -55 °C to 125 °C. Ideal for military applications, it ensures reliable data transmission with low load capacitance (50 pF).

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,455 parts In-Stock

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3,455

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Anansix

USA . 209 parts In-Stock

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Digiode

USA . 118 parts In-Stock

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Prism Electronics

USA . 16 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 784 parts In-Stock

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$1.269

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784

$1.269

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Northwest PG Solutions

USA . 2,027 parts In-Stock

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$1.396

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2,027

$1.396

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Andel Nordic

Denmark . 121 parts In-Stock

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$7.421

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$7.125

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$7.125

121

$7.421

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$7.125

$7.125

AZTECH Wire

Italy . 1,117 parts In-Stock

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$10.460

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$10.460

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

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$17.304

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$15.574

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$17.304

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$15.574

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MKK Technologies

India . 1,002 parts In-Stock

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$32.540

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$32.540

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DigiPath Technology Company

USA . 1,002 parts In-Stock

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$32.540

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$32.540

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Microchip USA

USA . 105 parts In-Stock

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$37.057

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QUARKTWIN TECHNOLOGY LTD

USA . 26,464 parts In-Stock

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Parana Technologies

USA . 1,001 parts In-Stock

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$20.690

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Corphita

USA . 986 parts In-Stock

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Perfect Parts

USA . 18 parts In-Stock

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Overview

Elevate your designs with the 74LCXH16245TTR from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for their commitment to quality and innovation, STMicroelectronics delivers exceptional reliability even at extreme temperatures. This versatile device boasts fast signal propagation and low power consumption, ensuring efficient performance across various applications—from telecommunications to industrial automation. Experience the difference in efficiency and performance with this cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating environments.

Propagation Delay At Nominal Supply: 5.3 ns

A low propagation delay enhances the performance and responsiveness of the device, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern electronics.

No. of Functions: 2

Having multiple functions enables versatile applications, thereby saving space and cost in circuit designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of PCB layout space, allowing for more compact designs.

No. of Bits: 8

An 8-bit configuration allows for sufficient data handling capability for a variety of applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low nominal supply voltage is energy-efficient and suitable for battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance results in improved switching speeds and reduces power consumption.

Power Supplies (V): 3.3

Compatible with standard power supplies, enabling straightforward integration into existing systems.

No. of Terminals: 48

A higher number of terminals allows for more connections and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch optimize space on the PCB, making it ideal for space-constrained applications.

Maximum I (ol): 24 Amp

The capability to handle high output current means this product can drive larger loads effectively.

Propagation Delay (tpd): 6 ns

A low propagation delay enhances system performance and supports high-speed data transmission.

Maximum Operating Temperature: 125 °C

A high operating temperature ensures reliability in extreme environments, making this product suitable for military applications.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in bus systems, allowing multiple devices to communicate without conflicts.

Minimum Operating Temperature: -55 °C

Low minimum operating temperatures are beneficial for applications in harsh conditions, ensuring reliable performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers superb conductivity and corrosion resistance, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal positions facilitate secure connections and ease of installation on PCBs.

No. of Ports: 2

Having two ports allows flexibility in communication pathways, making the product adaptable to different configurations.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact design, which is critical for space-restricted applications.

Width: 6.1 mm

Compact width further enhances suitability for modern electronics with tight space constraints.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels in digital circuits.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at low supply voltages broadens application possibilities, especially in power-sensitive designs.

Length: 12.5 mm

Short length contributes to overall space efficiency on PCBs, allowing for more components in a limited area.

Temperature Grade: MILITARY

Military-grade components ensure durability and reliability in high-stress environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient.

Terminal Form: GULL WING

Gull wing terminals are ideal for automated soldering processes and ensure strong mechanical connections.

Packing Method: TR

Transport reel packing is convenient for automated assembly and makes handling easier for manufacturers.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for high-density packaging, which is essential in modern electronic device compactness.

Count Direction: BIDIRECTIONAL

Bidirectional capability enhances flexibility in communication, allowing data to flow in both directions.

Control Type: COMMON CONTROL

Common control type simplifies design and reduces complexity in multi-chip environments.

Maximum Supply Voltage (Vsup): 3.6 V

Operating up to 3.6 V allows for compatibility with a variety of supply voltages in different applications.

Technical Specifications

Bus Driver & Transceivers 74LCXH16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.3 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74LCXH16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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