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74LCX541MTR

STMicroelectronics

74LCX541MTR by STMicroelectronics

STMicroelectronics 74LCX541MTR is an 8-bit bus driver with 3-STATE output, operating at a supply voltage range of 2V to 3.6V. It features a propagation delay of 9ns and can handle a max output current of 24A. Ideal for applications requiring fast signal transmission in compact spaces due to its small outline package style.

Median Price

$0.508

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$0.508

100+ parts

-

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600

$0.508

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Component Electronics Inc.

Canada . 10 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

10

$1.540

$1.150

$1.000

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Vyrian

USA . 3,416 parts In-Stock

1+ parts

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3,416

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Microfarads

USA . 1,643 parts In-Stock

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1,643

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Bristol Electronics

USA . 1,320 parts In-Stock

1+ parts

-

100+ parts

$0.341

1k+ parts

$0.168

10k+ parts

$0.147

1,320

-

$0.341

$0.168

$0.147

Anansix

USA . 1,199 parts In-Stock

1+ parts

-

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1,199

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R&J Components

USA . 911 parts In-Stock

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911

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Digiode

USA . 712 parts In-Stock

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712

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ComSIT Distribution GmbH

Germany . 280 parts In-Stock

1+ parts

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280

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Elcom Components

USA . 95 parts In-Stock

1+ parts

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95

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VNN

France . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.498

100+ parts

-

1k+ parts

$0.478

10k+ parts

-

100

$0.498

-

$0.478

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IDEA Electronic Components Group

UK . 1,799 parts In-Stock

1+ parts

$9.769

100+ parts

-

1k+ parts

$8.793

10k+ parts

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1,799

$9.769

-

$8.793

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Microchip USA

USA . 136 parts In-Stock

1+ parts

$11.264

100+ parts

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136

$11.264

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MKK Technologies

India . 1,510 parts In-Stock

1+ parts

$18.371

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1,510

$18.371

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DigiPath Technology Company

USA . 1,510 parts In-Stock

1+ parts

$18.371

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1,510

$18.371

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AZTECH Wire

Italy . 826 parts In-Stock

1+ parts

$19.822

100+ parts

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826

$19.822

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Ampacity Inc.

Singapore . 1,040 parts In-Stock

1+ parts

$63.000

100+ parts

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1,040

$63.000

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Perfect Parts

USA . 21,168 parts In-Stock

1+ parts

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21,168

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Corphita

USA . 3,539 parts In-Stock

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3,539

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Parana Technologies

USA . 2,026 parts In-Stock

1+ parts

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100+ parts

$11.681

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2,026

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$11.681

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Overview

Discover the unbeatable performance of the 74LCX541MTR by STMicroelectronics, a top-notch Bus Driver & Transceivers option that brings reliability and efficiency to your projects. With a solid reputation in the industry, STMicroelectronics guarantees high-quality standards and innovative technology in every component. This versatile product is ideal for a wide range of applications, providing seamless integration and exceptional functionality. Trust the 74LCX541MTR to deliver unmatched value and superior benefits, making it the perfect choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package makes the product durable and lightweight.

Propagation Delay: 8 ns

The low propagation delay of 8 ns ensures fast and efficient signal transmission.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the circuit board.

No. of Bits: 8

With 8 bits, this product is capable of handling a wide range of data transmission requirements.

Nominal Supply Voltage: 2.7V

Operating at 2.7V, this product is energy efficient and suitable for low power applications.

Power Supplies: 3.3V

With a power supply of 3.3V, this product is compatible with standard voltage levels in electronic systems.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for interfacing with other components.

Package Style: SMALL OUTLINE

The small outline package style saves space and allows for efficient PCB layout.

Maximum I (ol): 24 Amp

The high output current rating of 24 Amps ensures the product can drive heavy loads.

Propagation Delay: 9 ns

The low propagation delay of 9 ns helps in reducing the overall system latency.

Maximum Operating Temperature: 125°C

With a high operating temperature range, this product is suitable for harsh environments.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signals.

Minimum Operating Temperature: -55°C

The wide temperature range of -55°C to 125°C makes this product suitable for extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures reliable and robust connections.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures secure connections.

No. of Ports: 2

With 2 ports, this product offers multiple interface options for versatile applications.

Maximum Seated Height: 2.65 mm

The low seated height of 2.65 mm allows for compact design and minimal footprint.

Width: 7.5 mm

The narrow width of 7.5 mm saves space on the PCB and allows for efficient routing of traces.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission without any phase inversion.

Minimum Supply Voltage: 2V

The low minimum supply voltage of 2V allows for operation in low voltage applications.

Maximum Time At Peak Reflow Temperature: 30s

The maximum reflow time of 30 seconds ensures proper soldering and reliability.

Peak Reflow Temperature: 260°C

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes.

Length: 12.8 mm

The compact length of 12.8 mm makes this product suitable for space-constrained applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance in rugged conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering.

Packing Method: TR

The TR packing method ensures safe handling and storage during transportation and assembly.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise placement and soldering on the PCB.

Control Type: ENABLE LOW

The enable low control type provides a user-friendly interface for managing the device.

Moisture Sensitivity Level: 3

With a moisture sensitivity level of 3, this product is suitable for standard assembly processes.

Maximum Supply Voltage: 3.6V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power systems.

Technical Specifications

Bus Driver & Transceivers 74LCX541MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74LCX541MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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