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74LCX374MTR

STMicroelectronics

74LCX374MTR by STMicroelectronics

74LCX374MTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 8.5 ns, operating at a supply voltage of 2.7-3.6 V. It features a small outline package and is suitable for military-grade applications requiring true output polarity and positive edge triggering at frequencies up to 140 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Pegasus Components GmbH

Germany . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 5,095 parts In-Stock

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5,095

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Semi Source

USA . 5,000 parts In-Stock

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5,000

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Digiode

USA . 4,000 parts In-Stock

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4,000

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

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1,000

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Anansix

USA . 590 parts In-Stock

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590

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LWI Electronics Inc

India . 6 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 3,492 parts In-Stock

1+ parts

$1.677

100+ parts

-

1k+ parts

$1.610

10k+ parts

$1.610

3,492

$1.677

-

$1.610

$1.610

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$13.430

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954

$13.430

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IDEA Electronic Components Group

UK . 717 parts In-Stock

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$26.893

100+ parts

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$24.203

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717

$26.893

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$24.203

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Native Components

USA . 509 parts In-Stock

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$31.171

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$29.924

509

$31.171

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$29.924

Northwest PG Solutions

USA . 1,163 parts In-Stock

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$34.288

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1,163

$34.288

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MKK Technologies

India . 3 parts In-Stock

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$50.570

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$50.570

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DigiPath Technology Company

USA . 3 parts In-Stock

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$50.570

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3

$50.570

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A-Z Elektronik GmbH

Germany . 7,308 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 2,957 parts In-Stock

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2,957

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Kepictronics

USA . 200 parts In-Stock

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200

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Parana Technologies

USA . 177 parts In-Stock

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$32.154

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$32.154

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Assy Fe

Spain . 25 parts In-Stock

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25

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Overview

Elevate your electronic projects to the next level with the cutting-edge 74LCX374MTR bus driver & transceiver from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers exceptional performance and reliability in every component. This versatile device is perfect for a wide range of applications, offering customers seamless integration, fast propagation delay, and low power consumption. Experience the value and benefits of the 74LCX374MTR as you unlock new possibilities in your designs. Trust STMicroelectronics for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes this product durable and lightweight, suitable for use in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed bus driver and transceiver applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening standards ensures high reliability and quality performance in harsh environmental conditions.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a range of data processing tasks efficiently, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operates at a low nominal supply voltage, making it energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 50 pF

Designed to support a load capacitance of 50 pF, ensuring stable signal transmission and reception in the connected system.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies commonly used in electronic devices, offering easy integration into existing systems.

No. of Terminals: 20

With 20 terminals, this bus driver & transceiver provides ample connection options, enabling versatile configurations and connections.

Technical Specifications

Bus Driver & Transceivers 74LCX374MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

140000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74LCX374MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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