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74LCX245TTR

STMicroelectronics

74LCX245TTR by STMicroelectronics

STMicroelectronics' 74LCX245TTR is an 8-bit bus driver with a propagation delay of 8.1 ns at Vsup of 2.7V, suitable for bidirectional control applications. It operates in a temperature range from -55 to 125 °C and features a small outline package style with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,748 parts In-Stock

1+ parts

-

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7,748

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Chip Stock

USA . 3,855 parts In-Stock

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3,855

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Digiode

USA . 3,643 parts In-Stock

1+ parts

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3,643

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ComSIT Distribution GmbH

Germany . 2,986 parts In-Stock

1+ parts

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2,986

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A&K Electronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Rotakorn

Sweden . 2,500 parts In-Stock

1+ parts

-

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2,500

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Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

-

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2,500

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Legend Electronics Inc.

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Dan-Mar Components

USA . 1,779 parts In-Stock

1+ parts

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1,779

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Anansix

USA . 1,353 parts In-Stock

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1,353

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LWI Electronics Inc

India . 106 parts In-Stock

1+ parts

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106

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Prism Electronics

USA . 20 parts In-Stock

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20

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Netsource Technology, Inc.

USA . 11 parts In-Stock

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11

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 144 parts In-Stock

1+ parts

$6.358

100+ parts

-

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144

$6.358

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Andel Nordic

Denmark . 2,268 parts In-Stock

1+ parts

$10.035

100+ parts

-

1k+ parts

$9.633

10k+ parts

$9.633

2,268

$10.035

-

$9.633

$9.633

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$13.053

100+ parts

-

1k+ parts

$11.748

10k+ parts

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217

$13.053

-

$11.748

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AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$14.970

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275

$14.970

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MKK Technologies

India . 2,273 parts In-Stock

1+ parts

$24.545

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2,273

$24.545

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DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

$24.545

100+ parts

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2,273

$24.545

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Ampacity Inc.

Singapore . 431 parts In-Stock

1+ parts

$57.000

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431

$57.000

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Component Stockers USA

USA . 684 parts In-Stock

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$99.990

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684

$99.990

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Native Components

USA . 130 parts In-Stock

1+ parts

$205.820

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$197.587

130

$205.820

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$197.587

Northwest PG Solutions

USA . 2,307 parts In-Stock

1+ parts

$226.402

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-

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2,307

$226.402

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Perfect Parts

USA . 26,460 parts In-Stock

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26,460

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A-Z Elektronik GmbH

Germany . 5,733 parts In-Stock

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5,733

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Kepictronics

USA . 3,828 parts In-Stock

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3,828

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,596 parts In-Stock

1+ parts

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$15.607

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1,596

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$15.607

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Corphita

USA . 412 parts In-Stock

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412

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Cyclops Electronics Ltd (Excess)

UK . 33 parts In-Stock

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33

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Overview

Enhance your electronic designs with the superior quality and reliability of the 74LCX245TTR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers a wide range of innovative solutions for bus drivers and transceivers. This product provides seamless integration, high performance, and exceptional value for a variety of applications. Trust in STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the 74LCX245TTR and experience the difference that quality craftsmanship can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand harsh environmental conditions.

Propagation Delay At Nominal Supply: 8.1 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature makes installation easy and efficient, saving time and effort during assembly.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 ensures high reliability and quality, making the product suitable for critical military and aerospace applications.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission and processing capabilities, making the product versatile in various applications.

Nominal Supply Voltage / Vsup (V): 2.7

Low nominal supply voltage ensures energy efficiency and reduces power consumption, making the product cost-effective in the long run.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with a wide range of systems, making the product easy to integrate into existing setups.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, making the product adaptable to different configurations and setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch saves valuable board space, making the product ideal for compact and densely populated PCB layouts.

Maximum I (ol): 24 Amp

High maximum output current capability allows the product to drive heavier loads, making it suitable for demanding applications that require robust performance.

Propagation Delay (tpd): 9.2 ns

Low propagation delay ensures minimal signal distortion and fast response times, making the product ideal for high-speed communication and data transfer.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliability and performance in extreme environmental conditions, making the product suitable for industrial and automotive applications.

Output Characteristics: 3-STATE

3-state output allows the product to provide multiple signal states, making it versatile in applications where tri-state logic is required.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature range ensures the product can operate in cold environments without any performance degradation, making it suitable for outdoor applications.

Terminal Finish: BRIGHT TIN

Bright tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, making the product versatile in various assembly setups and configurations.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options, making the product suitable for applications that require multiple input/output channels.

Maximum Seated Height: 1.2 mm

Low maximum seated height saves board space and allows for compact module design, making the product suitable for space-constrained applications.

Width: 4.4 mm

Narrow width saves board space and allows for dense PCB layout, making the product suitable for applications with limited space constraints.

Output Polarity: TRUE

True output polarity ensures accurate signal communication, making the product reliable and consistent in data transmission.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources, making the product versatile and cost-effective.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and reliable connections during assembly, making the product easy to integrate into manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the soldering process without any damage, ensuring reliable and durable connections.

Length: 6.5 mm

Compact length saves board space and allows for efficient module design, making the product suitable for applications with size constraints.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the product can withstand harsh environmental conditions and extreme temperatures, making it suitable for rugged military and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and ensures secure soldering connections, making the product suitable for automated assembly processes.

Packing Method: TR

TR packing method provides convenience and protection during storage and transportation, making the product easy to handle and deploy in mass production.

Terminal Pitch: 0.65 mm

Narrow terminal pitch saves board space and allows for tight component placement, making the product suitable for high-density PCB layouts.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile signal transmission and reception capabilities, making the product adaptable to different data processing requirements.

Control Type: COMMON CONTROL

Common control feature simplifies signal processing and coordination, making the product easy to integrate into complex systems with multiple components.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates low moisture sensitivity, ensuring the product can withstand storage and assembly in humid environments without any damage or performance issues.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance ensures compatibility with a wide range of power sources, making the product versatile and adaptable to different system requirements.

Technical Specifications

Bus Driver & Transceivers 74LCX245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

8.1 ns

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

BRIGHT TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74LCX245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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