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74LCX16244TTR

STMicroelectronics

74LCX16244TTR by STMicroelectronics

74LCX16244TTR by STMicroelectronics is a bus driver with 4 functions, operating at 2.7V to 3.6V. It features a propagation delay of 4.5 ns, output polarity TRUE, and supports load capacitance of 50 pF. Ideal for applications requiring fast signal transmission in compact spaces like military-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Vyrian

USA . 7,667 parts In-Stock

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EMSNET

USA . 4,000 parts In-Stock

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Digiode

USA . 992 parts In-Stock

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Anansix

USA . 562 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 88 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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LWI Electronics Inc

India . 8 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Northwest PG Solutions

USA . 321 parts In-Stock

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$2.736

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321

$2.736

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$12.631

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$11.494

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$10.357

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$12.631

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AZTECH Wire

Italy . 553 parts In-Stock

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$20.950

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IDEA Electronic Components Group

UK . 93 parts In-Stock

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$24.689

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Corohmni

South Africa . 106 parts In-Stock

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$26.941

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MKK Technologies

India . 1,314 parts In-Stock

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DigiPath Technology Company

USA . 1,314 parts In-Stock

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Component Stockers USA

USA . 700 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

Germany . 6,855 parts In-Stock

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Microchip USA

USA . 4,987 parts In-Stock

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Corphita

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Assy Fe

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Parana Technologies

USA . 799 parts In-Stock

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Native Components

USA . 305 parts In-Stock

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Overview

Elevate your electronics projects with the 74LCX16244TTR by STMicroelectronics. This high-quality bus driver & transceiver offers unparalleled reliability and performance, thanks to the renowned manufacturer's expertise in cutting-edge technology. Ideal for a wide range of applications, this product provides seamless connectivity and efficient data transmission. Experience the value and benefits of this versatile component, designed to enhance your designs and deliver exceptional results. Upgrade your projects with the 74LCX16244TTR and bring innovation to the forefront of your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 4.5 ns

The low propagation delay ensures fast data transmission, making the product efficient.

Surface Mount: YES

Surface mount capability makes it easy to integrate the product into circuit boards, saving space and simplifying manufacturing.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components, improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 2.7

The low nominal supply voltage helps in reducing power consumption and increasing energy efficiency.

Power Supplies (V): 3.3

The power supply voltage of 3.3V is commonly used in electronic devices, making it compatible with a wide range of applications.

No. of Terminals: 48

Having a high number of terminals allows for more connections and functionalities in the product.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state when disabled, reducing power consumption and preventing conflicts on the bus.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making the product reliable and efficient.

Technical Specifications

Bus Driver & Transceivers 74LCX16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74LCX16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-628-1686, 5962016281686

NIIN

016281686

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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