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74LCX125TTR

STMicroelectronics

74LCX125TTR by STMicroelectronics

74LCX125TTR by STMicroelectronics is a 4-function bus driver with a propagation delay of 5.2ns at 3.3V, suitable for military-grade applications. It features a small outline package with dual terminals and operates within a temperature range of -55 to 125 °C, making it ideal for high-performance electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Corel Iberica Componentes, S.L.

Spain . 7,265 parts In-Stock

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7,265

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Vyrian

USA . 6,117 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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5,000

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Microfarads

USA . 2,858 parts In-Stock

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2,858

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Digiode

USA . 2,250 parts In-Stock

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Prism Electronics

USA . 2,153 parts In-Stock

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Bristol Electronics

USA . 1,836 parts In-Stock

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Legend Electronics Inc.

USA . 1,495 parts In-Stock

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1,495

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GES GmbH

Germany . 967 parts In-Stock

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Anansix

USA . 79 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 52 parts In-Stock

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Semi Source

USA . 25 parts In-Stock

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25

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Native Components

USA . 565 parts In-Stock

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$8.355

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565

$8.355

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Northwest PG Solutions

USA . 3 parts In-Stock

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$9.190

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$8.271

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3

$9.190

$8.271

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AZTECH Wire

Italy . 923 parts In-Stock

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$13.830

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923

$13.830

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IDEA Electronic Components Group

UK . 1,424 parts In-Stock

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$27.103

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$24.393

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$27.103

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MKK Technologies

India . 1,840 parts In-Stock

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$50.966

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$50.966

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DigiPath Technology Company

USA . 1,840 parts In-Stock

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$50.966

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$50.966

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Ampacity Inc.

Singapore . 627 parts In-Stock

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$51.000

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627

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Perfect Parts

USA . 41,162 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,267 parts In-Stock

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Assy Fe

Spain . 7,265 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,899 parts In-Stock

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Microchip USA

USA . 3,912 parts In-Stock

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Metaverse IC Inc.

Canada . 1,472 parts In-Stock

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Parana Technologies

USA . 1,422 parts In-Stock

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$32.406

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Corphita

USA . 577 parts In-Stock

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Kepictronics

USA . 321 parts In-Stock

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Overview

Enhance your electronic projects with the top-notch quality of STMicroelectronics' 74LCX125TTR bus driver & transceiver. With a strong reputation for excellence, STMicroelectronics delivers a reliable product that exceeds expectations. This versatile component is perfect for a wide range of applications, offering customers unparalleled value, benefits, and advantages. Upgrade your designs with the 74LCX125TTR and experience superior performance and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for use in a portable and rugged environment such as buses.

Propagation Delay At Nominal Supply: 5.2 ns

Low propagation delay ensures quick signal processing, essential for real-time communication in bus driver and transceiver applications.

Surface Mount: YES

Surface mount compatibility allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 4

Having multiple functions in a single component minimizes the need for additional components, simplifying the design and reducing costs.

Nominal Supply Voltage / Vsup (V): 2.7

Low nominal supply voltage helps in reducing power consumption and operating costs in bus driver and transceiver systems.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with other components and systems commonly used in bus communication systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliability and performance even in harsh environmental conditions typically encountered in buses.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making it an efficient choice for bus driver and transceivers.

Technical Specifications

Bus Driver & Transceivers 74LCX125TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

6.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX125TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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