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74LCX08TTR

STMicroelectronics

74LCX08TTR by STMicroelectronics

74LCX08TTR by STMicroelectronics is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 4.1 ns at a nominal voltage of 2.7V, making it ideal for high-speed applications in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 15,000 parts In-Stock

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Digiode

USA . 4,914 parts In-Stock

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Vyrian

USA . 3,632 parts In-Stock

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Speed Components Ltd

Israel . 2,346 parts In-Stock

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Bristol Electronics

USA . 1,769 parts In-Stock

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1,769

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Dan-Mar Components

USA . 1,769 parts In-Stock

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1,769

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Anansix

USA . 529 parts In-Stock

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529

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Ack Elektronik San.Tic.Ltd.Sti

. 276 parts In-Stock

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LWI Electronics Inc

India . 90 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 393 parts In-Stock

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$2.587

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393

$2.587

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AZTECH Wire

Italy . 279 parts In-Stock

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$8.060

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

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$10.113

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$9.101

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MKK Technologies

India . 1,447 parts In-Stock

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$19.016

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DigiPath Technology Company

USA . 1,447 parts In-Stock

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$19.016

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A-Z Elektronik GmbH

Germany . 4,884 parts In-Stock

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Corphita

USA . 4,744 parts In-Stock

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Northwest PG Solutions

USA . 2,122 parts In-Stock

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$4.369

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Parana Technologies

USA . 2,027 parts In-Stock

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$12.091

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Infinite Electronics LLP (Excess)

. 1,731 parts In-Stock

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Native Components

USA . 220 parts In-Stock

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Kepictronics

USA . 115 parts In-Stock

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Overview

Unlock the power of precision and reliability with the 74LCX08TTR logic gate by STMicroelectronics. Crafted with top-notch quality and cutting-edge technology, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this logic gate delivers superior functionality, speed, and efficiency. Experience seamless integration and enhanced productivity with the 74LCX08TTR, setting new standards in the world of logic gates. Elevate your projects with the best-in-class solution that STMicroelectronics has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 4.1 ns

The low propagation delay ensures fast signal processing, making these logic gates suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mountable makes these logic gates easy to integrate onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Having multiple functions in a single package increases the versatility and flexibility of these logic gates, allowing them to perform a variety of tasks in a circuit.

Nominal Supply Voltage: 2.7V

Operating at a low supply voltage of 2.7V makes these logic gates energy efficient and ideal for applications where power consumption is a concern.

Technology: CMOS

The use of CMOS technology results in low power consumption and high noise immunity, making these logic gates reliable and efficient in various electronic circuits.

Technical Specifications

Logic Gates 74LCX08TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LCX08TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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