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74LCX07MTR

STMicroelectronics

74LCX07MTR by STMicroelectronics

74LCX07MTR by STMicroelectronics is a CMOS logic gate with a propagation delay of 5.2 ns and operates at supply voltages b/w 2-3.6 V. It features open-drain outputs, making it ideal for interfacing applications in industrial environments. With a compact 14-terminal SO package, it's perfect for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,951 parts In-Stock

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Anansix

USA . 2,701 parts In-Stock

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Digiode

USA . 445 parts In-Stock

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445

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LWI Electronics Inc

India . 20 parts In-Stock

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Microchip USA

USA . 409 parts In-Stock

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$2.432

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409

$2.432

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AZTECH Wire

Italy . 830 parts In-Stock

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$20.430

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830

$20.430

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

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$23.486

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$21.137

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$23.486

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$21.137

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MKK Technologies

India . 1,480 parts In-Stock

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$44.163

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$44.163

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DigiPath Technology Company

USA . 1,480 parts In-Stock

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$44.163

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$44.163

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A-Z Elektronik GmbH

Germany . 5,547 parts In-Stock

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Corphita

USA . 4,003 parts In-Stock

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Parana Technologies

USA . 802 parts In-Stock

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$28.081

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Perfect Parts

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Native Components

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Kepictronics

USA . 188 parts In-Stock

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Northwest PG Solutions

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Cyclops Electronics Ltd (Excess)

UK . 90 parts In-Stock

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Overview

Unlock the power of precision with the 74LCX07MTR from STMicroelectronics! This high-performance logic gate delivers unmatched reliability and speed, ideal for a variety of applications including data transmission, signal processing, and advanced circuit designs. With ST's renowned commitment to quality and innovation, you can trust that this component will enhance your projects while ensuring efficiency and durability. Experience the seamless integration and robust performance that sets your designs apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, suitable for various applications.

Propagation Delay At Nominal Supply: 5.2 ns

A low propagation delay ensures fast signal switching, making it ideal for high-speed applications.

Surface Mount: YES

Being surface-mounted enhances the compactness of PCB designs, saving space and improving reliability.

No. of Functions: 6

Having multiple functions allows for flexibility in circuit design, reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package design facilitates efficient layout and space utilization on circuit boards.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V ensures compatibility with low-power applications, enhancing energy efficiency.

Load Capacitance (CL): 50 pF

The load capacitance is optimized for reliable performance in digital circuits, supporting device stability.

Power Supplies (V): 3.3

Compatible with commonly used power supplies, making integration into existing systems seamless.

No. of Terminals: 14

With 14 terminals, it offers various connectivity options, enhancing its versatility in different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact footprint, ideal for space-constrained designs.

Maximum I (ol): 24 Amp

A high output current capability supports demanding applications, ensuring robust performance.

Propagation Delay (tpd): 7 ns

Quick propagation delay signifies efficient signal processing, suitable for high-speed digital circuits.

Maximum Operating Temperature: 85 °C

The ability to function at high temperatures ensures reliability in challenging environments.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for multiple devices to be connected on the same line, facilitating easier design for shared bus systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enhances its stability and functionality in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish ensures superior connectivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal position simplifies PCB layout and soldering process, improving manufacturing efficiency.

Maximum Seated Height: 1.75 mm

Low seated height accommodates dense layouts, meeting the requirements of modern electronic designs.

Width: 3.9 mm

A compact width allows for greater flexibility in PCB design and placement of other components.

Minimum Supply Voltage (Vsup): 2 V

Operational down to 2V enables use in low-voltage applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

An extended peak reflow time improves soldering quality, enhancing assembly reliability.

Peak Reflow Temperature (°C): 260

High tolerance for reflow temperature ensures compatibility with various assembly processes and materials.

Length: 8.65 mm

The length makes it suitable for standard PCB configurations, facilitating easier integration into existing designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade enhances durability, ensuring reliable performance in rigorous conditions.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making it perfect for portable devices.

Terminal Form: GULL WING

Gull wing terminals provide enhanced solderability and secure physical connections on PCBs.

Packing Method: TR

Tape and reel (TR) packing ensures efficient handling and automated assembly, improving production efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with a variety of PCB footprints, simplifying design processes.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a commonly used higher supply voltage, enhancing its adaptability in diverse applications.

Technical Specifications

Logic Gates 74LCX07MTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74LCX07MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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