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74ACT174MTR

STMicroelectronics

74ACT174MTR by STMicroelectronics

74ACT174MTR by STMicroelectronics is a 6-bit CMOS latch with a max frequency of 140 MHz and a propagation delay of just 11.5 ns. It operates at a nominal voltage of 5V, making it ideal for high-speed digital applications. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,492 parts In-Stock

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3,492

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Digiode

USA . 2,460 parts In-Stock

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2,460

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Anansix

USA . 2,234 parts In-Stock

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2,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 613 parts In-Stock

1+ parts

$0.620

100+ parts

-

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-

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613

$0.620

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Northwest PG Solutions

USA . 1,230 parts In-Stock

1+ parts

$0.682

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

$0.682

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-

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$13.700

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-

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253

$13.700

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$19.627

100+ parts

-

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$17.665

10k+ parts

-

2,216

$19.627

-

$17.665

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Corohmni

South Africa . 21 parts In-Stock

1+ parts

$23.369

100+ parts

-

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21

$23.369

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$29.572

100+ parts

$26.911

1k+ parts

$24.249

10k+ parts

-

70

$29.572

$26.911

$24.249

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MKK Technologies

India . 305 parts In-Stock

1+ parts

$36.908

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305

$36.908

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DigiPath Technology Company

USA . 305 parts In-Stock

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$36.908

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305

$36.908

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Component Stockers USA

USA . 576 parts In-Stock

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$99.990

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576

$99.990

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Kepictronics

USA . 19,250 parts In-Stock

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19,250

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Corphita

USA . 4,607 parts In-Stock

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4,607

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Microchip USA

USA . 3,367 parts In-Stock

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3,367

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Parana Technologies

USA . 1,289 parts In-Stock

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$23.467

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1,289

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$23.467

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

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100+ parts

$23.181

1k+ parts

$21.466

10k+ parts

$21.466

250

-

$23.181

$21.466

$21.466

Overview

Unlock unparalleled performance with the 74ACT174MTR from STMicroelectronics—your reliable partner in advanced latches and flip-flops. Engineered for precision and efficiency, this robust device excels in high-speed applications, ensuring seamless data handling in your electronic designs. STMicroelectronics guarantees top-tier quality and innovation, enhancing your projects with superior reliability and longevity. Elevate your systems and experience unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material provides reliable protection and insulation, making it suitable for various applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, saving space and enhancing performance in modern electronics.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space on circuit boards, facilitating efficient component layout.

No. of Bits: 6

A 6-bit configuration allows for moderate data processing capabilities, ideal for many digital applications.

Nominal Supply Voltage / Vsup: 5 V

Standard supply voltage ensures compatibility with a wide range of digital circuits and applications.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes power consumption and improves switching speeds, enhancing overall performance.

Power Supplies (V): 5

Single 5V power supply simplifies design and reduces component count in the power management system.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various inputs and outputs in diverse applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style is perfect for space-constrained applications, ensuring efficient use of PCB area.

Maximum I (ol): 24 Amp

High output current capacity supports demanding applications involving larger loads, enhancing versatility.

Propagation Delay (tpd): 11.5 ns

Fast propagation delay ensures quick data processing and response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enables reliable performance in harsh environments, catering to industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for synchronous operation with clock signals, facilitating data integrity and timing control.

Minimum Operating Temperature: -55 °C

Extremely low minimum operating temperature ensures reliable performance in extreme cold conditions, suitable for military applications.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing on circuit boards, enhancing layout flexibility.

Maximum Seated Height: 1.75 mm

Low seated height is advantageous for compact circuit designs, allowing for more layered or denser layouts.

Width: 3.9 mm

Narrow width contributes to compact designs for high-density applications, making it ideal for modern electronics.

Output Polarity: TRUE

True output polarity ensures straightforward integration into logic circuits, simplifying design requirements.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V enables operation in a variety of applications with varying power budgets.

Length: 9.9 mm

Compact length supports smaller designs and is ideal for high-density applications where space is critical.

Temperature Grade: MILITARY

MILITARY-grade components ensure reliability and performance in extreme conditions, making them perfect for defense applications.

Maximum Frequency At Nominal Supply: 140000000 Hz

High maximum frequency capability allows for advanced processing speeds in complex digital circuits.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, increasing the efficiency of digital devices.

Terminal Form: GULL WING

Gull wing terminals facilitate robust soldering, enhancing reliability in surface mount applications.

Packing Method: TR

Tape and reel packing method ensures efficient handling and assembly during manufacturing, reducing production time.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB design and assembly processes, making it easier to integrate into various applications.

Minimum fmax: 140 MHz

High minimum frequency maximization enhances data throughput, making it suitable for high-performance applications.

Maximum Supply Voltage (Vsup): 5.5 V

Extended maximum supply voltage provides flexibility in power design, accommodating a range of operating conditions.

Technical Specifications

Latches & Flip-Flops 74ACT174MTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

140000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

140 MHz

Trade Compliance

74ACT174MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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