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74ACT16245TTR

STMicroelectronics

74ACT16245TTR by STMicroelectronics

74ACT16245TTR by STMicroelectronics is a CMOS bus driver with an 8-bit capacity, featuring a fast propagation delay of 8.7 ns and operating at a nominal voltage of 5V. It supports bidirectional data flow and operates in extreme temperatures from -55 °C to 125°C. Ideal for military applications, it comes in a compact SOIC package with robust nickel-palladium-gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,316 parts In-Stock

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4,316

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Anansix

USA . 2,083 parts In-Stock

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2,083

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Digiode

USA . 776 parts In-Stock

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776

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Distributors (Availability)

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Andel Nordic

Denmark . 5,351 parts In-Stock

1+ parts

$6.073

100+ parts

-

1k+ parts

$5.830

10k+ parts

$5.830

5,351

$6.073

-

$5.830

$5.830

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$16.140

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-

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217

$16.140

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$23.619

100+ parts

$21.493

1k+ parts

$19.368

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-

3,000

$23.619

$21.493

$19.368

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IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$30.781

100+ parts

-

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$27.703

10k+ parts

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1,031

$30.781

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$27.703

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Microchip USA

USA . 464 parts In-Stock

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$31.958

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464

$31.958

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MKK Technologies

India . 2,153 parts In-Stock

1+ parts

$57.882

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2,153

$57.882

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DigiPath Technology Company

USA . 2,153 parts In-Stock

1+ parts

$57.882

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2,153

$57.882

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Northwest PG Solutions

USA . 1,386 parts In-Stock

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1,386

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Corphita

USA . 858 parts In-Stock

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858

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Native Components

USA . 726 parts In-Stock

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726

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Parana Technologies

USA . 614 parts In-Stock

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$36.804

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614

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$36.804

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Overview

Unlock superior performance with the 74ACT16245TTR from STMicroelectronics, a trusted leader in cutting-edge technology. This high-quality bus driver and transceiver delivers unmatched speed and reliability, ideal for demanding applications like industrial automation and telecommunications. Its robust design ensures seamless data transfer, while the compact package saves space in your designs. Elevate your projects with proven excellence that meets military standards—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides excellent protection against moisture and environmental factors, ensuring durability and longevity of the device.

Propagation Delay At Nominal Supply: 8.7 ns

With a low propagation delay, this product ensures quick data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern electronic circuits.

No. of Functions: 2

Having multiple functions allows for versatile application, reducing the need for multiple components and saving board space.

Package Shape: RECTANGULAR

The rectangular shape optimally uses board space and simplifies layout designs.

No. of Bits: 8

An 8-bit architecture is well-suited for a variety of applications, supporting efficient data handling.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows compatibility with a wide range of other electronic components.

Power Supplies (V): 5

Single power supply requirement simplifies the design and reduces the number of necessary power management components.

No. of Terminals: 48

With 48 terminals, this product supports extensive connectivity, enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline are ideal for space-constrained applications, making it adaptable to various design needs.

Maximum I (ol): 24 Amp

Supporting a high output current of 24 Amps enhances the device's capability to drive larger loads efficiently.

Propagation Delay (tpd): 11.5 ns

The propagation delay of 11.5 ns, while higher than the nominal supply, ensures reliable data transmission in high-speed environments.

Maximum Operating Temperature: 125 °C

That high operating temperature rating allows the device to function effectively in demanding environments.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for flexible connectivity in complex circuits, enabling tri-state operation.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C makes this product suitable for applications in extreme environments, including aerospace and military.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, ensuring reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning aids in efficient routing and enhances the design flexibility.

No. of Ports: 2

With two ports, this device facilitates bi-directional communication, enhancing its versatility.

Maximum Seated Height: 1.2 mm

The low seated height allows for slim designs, making it a fit for compact electronic applications.

Width: 6.1 mm

The compact width is ideal for high-density circuit layouts, optimizing board space.

Output Polarity: TRUE

True output polarity enhances compatibility with a variety of systems and components.

Minimum Supply Voltage (Vsup): 4.5 V

Operating down to 4.5V increases flexibility in power supply variations.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C makes it suitable for modern soldering techniques, ensuring robust assembly processes.

Length: 12.5 mm

The length is optimized for integration into various devices without compromising the design's aesthetics.

Temperature Grade: MILITARY

Meeting military temperature specifications ensures reliability and performance in critical applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making it ideal for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve solder joint reliability.

Packing Method: TR

Tape and reel packing ensures efficient handling and easy integration into automated assembly lines.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for more compact designs and enables efficient use of PCB real estate.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities enhance the product's functionality in data transfer applications.

Control Type: COMMON CONTROL

Common control simplifies the interfacing with microcontrollers and other digital devices, providing ease of use.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V adds a margin for voltage fluctuations, enhancing overall reliability.

Technical Specifications

Bus Driver & Transceivers 74ACT16245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.7 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ACT16245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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