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74ACT04TTR

STMicroelectronics

74ACT04TTR by STMicroelectronics

74ACT04TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9.5 ns, operating at a nominal voltage of 5V. It features six functions in a compact 14-terminal package, ideal for military applications. Its robust design supports temperatures from -55 °C to 125°C.

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 6,154 parts In-Stock

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Digiode

USA . 2,978 parts In-Stock

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2,978

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Anansix

USA . 2,196 parts In-Stock

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2,196

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Native Components

USA . 454 parts In-Stock

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$15.403

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454

$15.403

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Microchip USA

USA . 142 parts In-Stock

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$15.940

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142

$15.940

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Northwest PG Solutions

USA . 1,256 parts In-Stock

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$16.944

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$15.249

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$16.944

$15.249

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AZTECH Wire

Italy . 708 parts In-Stock

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$21.560

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708

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IDEA Electronic Components Group

UK . 684 parts In-Stock

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$28.410

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$25.569

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$34.043

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$30.979

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$27.915

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52

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MKK Technologies

India . 89 parts In-Stock

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$53.422

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DigiPath Technology Company

USA . 89 parts In-Stock

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$53.422

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Corphita

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Parana Technologies

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Overview

Unlock unparalleled performance in your electronic designs with the 74ACT04TTR from STMicroelectronics. Renowned for its superior quality and reliability, this logic gate offers swift propagation delays, making it ideal for high-speed applications. With a compact surface mount package and military-grade durability, it's perfect for automotive, industrial, and consumer electronics. Elevate your projects with ST's commitment to innovation and excellence—where every connection matters!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making this product reliable in various applications.

Propagation Delay At Nominal Supply: 9.5 ns

A low propagation delay ensures fast switching speeds, which is critical for high-speed digital circuits, enhancing overall performance.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB real estate and simplifies assembly processes in modern electronics.

No. of Functions: 6

With six functions, this logic gate can perform multiple operations, providing versatility and reducing component count on the board.

Package Shape: RECTANGULAR

The rectangular shape is optimized for layout efficiency and enables easy integration into various electronic designs.

Nominal Supply Voltage / Vsup (V): 5

Designed for a nominal supply voltage of 5V, it is compatible with standard logic levels used in most digital circuits.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for effective signal integrity while minimizing power dissipation, ideal for battery-powered applications.

Power Supplies (V): 5

Operating on a standard 5V power supply ensures compatibility with a wide range of digital systems and components.

No. of Terminals: 14

With 14 terminals, this gate provides numerous connection points for versatile circuit configurations and ease of integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained applications, especially in portable devices.

Maximum I (ol): 24 Amp

A high output current allows this logic gate to drive larger loads, making it suitable for more demanding applications.

Propagation Delay (tpd): 9.5 ns

The consistent 9.5 ns propagation delay signifies reliable performance across different operating conditions.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures stability in harsh environments, suitable for military or industrial applications.

Minimum Operating Temperature: -55 °C

The capability to operate at extreme low temperatures ensures reliability in cold environments, beneficial for aerospace and military uses.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent corrosion resistance and superior electrical conductivity, enhancing durability and performance.

Terminal Position: DUAL

Dual terminal positions offer flexible routing options on the PCB, allowing better design optimization.

Maximum Seated Height: 1.2 mm

A low seated height ensures a compact design, enabling the product to fit into tight spaces in advanced electronic assemblies.

Width: 4.4 mm

The narrow width allows for denser component placement on printed circuit boards, facilitating miniaturization of devices.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum operating voltage of 4.5V broadens its compatibility with a range of power sources.

Length: 5 mm

The compact length enables efficient design layouts and is ideal for space-constrained applications.

Temperature Grade: MILITARY

With a military-grade temperature specification, this component is designed for high reliability in challenging environments.

Technology: CMOS

Using CMOS technology ensures low power consumption and high-speed performance, making it suitable for modern digital devices.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering characteristics and allows for automatic assembly processes.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies the handling and integration process during assembly, ensuring efficiency.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch enables high-density layouts, making it suitable for modern compact electronics.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage provides flexibility in design, accommodating various circuit configurations.

Technical Specifications

Logic Gates 74ACT04TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74ACT04TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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