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74ACT02B

STMicroelectronics

74ACT02B by STMicroelectronics

74ACT02B by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 11ns. This through-hole package is ideal for military-grade applications requiring fast signal processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,893 parts In-Stock

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Anansix

USA . 2,114 parts In-Stock

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Digiode

USA . 1,496 parts In-Stock

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Microchip USA

USA . 304 parts In-Stock

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$18.143

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304

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AZTECH Wire

Italy . 835 parts In-Stock

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$21.630

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835

$21.630

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Ampacity Inc.

Singapore . 859 parts In-Stock

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$24.000

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$24.000

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$25.090

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$22.581

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842

$25.090

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$22.581

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MKK Technologies

India . 269 parts In-Stock

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$47.181

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$47.181

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DigiPath Technology Company

USA . 269 parts In-Stock

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$47.181

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Component Stockers USA

USA . 338 parts In-Stock

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$99.990

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$99.990

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Parana Technologies

USA . 1,223 parts In-Stock

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$29.999

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Northwest PG Solutions

USA . 1,222 parts In-Stock

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$4.633

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Corphita

USA . 546 parts In-Stock

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Native Components

USA . 383 parts In-Stock

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Assy Fe

Spain . 250 parts In-Stock

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Overview

Unlock the power of logic gates with the 74ACT02B by STMicroelectronics. This high-quality product offers unparalleled performance and reliability, making it the ideal choice for a wide range of applications. With a low propagation delay and multiple functions packed into one compact package, this logic gate delivers exceptional value to customers looking for precision and efficiency in their designs. Trust STMicroelectronics to provide innovative solutions that meet your needs and exceed your expectations. Upgrade your circuits today with the 74ACT02B and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast processing of signals, making the product suitable for high-speed applications.

No. of Functions: 4

Having 4 functions in one package reduces the overall component count in a circuit, saving space and simplifying design.

No. of Inputs: 2

With 2 inputs, this logic gate can perform basic logic operations efficiently, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with most systems and easy to integrate into existing circuits.

Load Capacitance (CL): 50 pF

The low load capacitance allows for faster signal transitions, ensuring reliable performance in high-frequency applications.

Power Supplies (V): 5

Operating at 5V ensures efficient power consumption and compatibility with standard voltage levels in electronic systems.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the logic gate with other components, enabling complex circuit designs.

Maximum I (ol): 24 Amp

The high output current capability allows the logic gate to drive multiple loads without external buffering, simplifying circuit design.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the product can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making it suitable for various environments.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and corrosion resistance, ensuring long-term reliability in diverse operating conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates 74ACT02B attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

ACT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74ACT02B Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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