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74AC16244TTR

STMicroelectronics

74AC16244TTR by STMicroelectronics

74AC16244TTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 11.5 ns, supporting dual ports and operating b/w 2V to 6V. It features a compact SO thin profile package and handles up to 24A output current. Ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,968 parts In-Stock

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Digiode

USA . 4,641 parts In-Stock

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4,641

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Inventory MP

USA . 1,237 parts In-Stock

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1,237

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Bristol Electronics

USA . 1,237 parts In-Stock

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Anansix

USA . 397 parts In-Stock

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397

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Distributors (Availability)

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Native Components

USA . 299 parts In-Stock

1+ parts

$0.086

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-

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$0.083

299

$0.086

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$0.083

Northwest PG Solutions

USA . 1,717 parts In-Stock

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$0.095

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-

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$0.083

1,717

$0.095

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$0.083

Andel Nordic

Denmark . 2,945 parts In-Stock

1+ parts

$5.877

100+ parts

-

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$5.642

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$5.642

2,945

$5.877

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$5.642

$5.642

Microchip USA

USA . 383 parts In-Stock

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$15.162

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383

$15.162

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AZTECH Wire

Italy . 1,029 parts In-Stock

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$21.990

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$21.990

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

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$26.046

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$23.442

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1,089

$26.046

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$23.442

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MKK Technologies

India . 1,342 parts In-Stock

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$48.978

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1,342

$48.978

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DigiPath Technology Company

USA . 1,342 parts In-Stock

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$48.978

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1,342

$48.978

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Corphita

USA . 4,491 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 628 parts In-Stock

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$31.142

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628

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$31.142

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Overview

Elevate your designs with the 74AC16244TTR from STMicroelectronics, a trusted leader in quality and innovation. This versatile bus driver and transceiver enhances performance with superior speed and efficiency, making it ideal for a wide range of applications—from automotive to industrial systems. Benefit from its reliable operation in demanding environments, ensuring longevity and peak performance while enjoying peace of mind backed by ST's renowned expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay enhances the speed of data transmission, allowing for efficient communication in high-performance systems.

Surface Mount: YES

Surface mount capabilities enable compact designs and higher integration on PCBs, saving space and improving assembly efficiency.

No. of Functions: 4

The availability of multiple functions in one package reduces component count, simplifying design and potentially lowering costs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, making it easy to fit into tight spaces on circuit boards.

No. of Bits: 4

With 4 bits, this product can efficiently handle data transfer for various applications requiring parallel data lines.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V is ideal for modern low-power applications, making it compatible with contemporary circuits.

Load Capacitance (CL): 50 pF

This low load capacitance minimizes signal degradation, ensuring reliable performance in high-speed communication environments.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies provides versatility for use in various systems and designs.

No. of Terminals: 48

A high number of terminals allows for extensive connectivity options, enabling complex designs and greater flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable PCB space and support high-density applications.

Maximum I (ol): 24 Amp

The capability to handle up to 24 Amps makes this product suitable for power-intensive applications.

Propagation Delay (tpd): 11.5 ns

With a comparable propagation delay, this matches the performance needed for high-speed applications.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures reliability in demanding environments, making it suitable for military or industrial applications.

Output Characteristics: 3-STATE

3-state output capability allows for shared bus configurations, providing flexibility in circuit design.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures that the product performs reliably in extreme conditions, ideal for military-grade applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances the reliability of electrical connections and resists corrosion, extending product life.

Terminal Position: DUAL

Dual terminal positions facilitate easier PCB layout and integration, improving design efficiency.

No. of Ports: 2

Supporting two ports allows for easy interconnectivity, making the product suitable for multi-port applications.

Maximum Seated Height: 1.2 mm

The low seated height allows for thinner designs, accommodating modern slim-profile layout requirements.

Width: 6.1 mm

A compact width contributes to overall space optimization on the printed circuit board.

Output Polarity: TRUE

True output polarity is essential for compatibility with various signal types and ensures predictable behavior in circuits.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for integration in battery-operated devices, enhancing power management.

Peak Reflow Temperature °C: 260

The capability to withstand high reflow temperatures ensures compatibility with lead-free soldering processes, making it suitable for modern manufacturing.

Length: 12.5 mm

A compact length promotes efficient use of board space while still allowing for adequate performance.

Temperature Grade: MILITARY

Designed to military standards, this product ensures durability and reliability in critical applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher efficiency, making it ideal for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide superior solderability and mechanical stability, making them easier to work with in assembly.

Packing Method: TR

Tape and Reel (TR) packing facilitates automated assembly processes, enhancing production efficiency.

Terminal Pitch: 0.5 mm

A smaller terminal pitch supports higher density designs, accommodating modern miniaturization trends.

Control Type: ENABLE LOW

Low enable control type ensures a straightforward interface, simplifying system integration and control.

Maximum Supply Voltage (Vsup): 6 V

A high maximum supply voltage provides flexibility for powering diverse applications and enhances adaptability.

Technical Specifications

Bus Driver & Transceivers 74AC16244TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74AC16244TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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