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ZGM130S037HGN2

Silicon Labs

ZGM130S037HGN2 by Silicon Labs

Silicon Labs ZGM130S037HGN2 is a 64-terminal telecom IC with 1.8V supply voltage, -40 to 85°C operating temp range, and 260°C peak reflow temp. It's a square surface-mount chip carrier suitable for industrial applications requiring telecom circuit interfaces.

Median Price

$11.572

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 112 parts In-Stock

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$2.390

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$2.390

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Farnell

UK . 99 parts In-Stock

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$7.758

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$7.758

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Verical

USA . 112 parts In-Stock

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$9.496

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$9.496

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Newark

USA . 99 parts In-Stock

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$11.170

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$9.300

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$11.170

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Element14

Singapore . 99 parts In-Stock

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$13.550

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$10.177

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$9.827

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99

$13.550

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$9.827

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DigiKey

USA . 1,055 parts In-Stock

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$13.910

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$11.466

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$9.612

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$9.362

1,055

$13.910

$11.466

$9.612

$9.362

Mouser Electronics

USA . 359 parts In-Stock

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$13.910

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$10.190

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$9.420

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$13.910

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$9.420

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RS (Exports)

UK . 29 parts In-Stock

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$11.973

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Digiode

USA . 96 parts In-Stock

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$7.370

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Nova Conductors

Japan . 450 parts In-Stock

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$8.966

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Bristol Electronics

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Chip Stock

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Vyrian

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Semicontronic

India . 258 parts In-Stock

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$6.590

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$6.425

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$6.392

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$6.590

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Ampacity Inc.

Singapore . 142 parts In-Stock

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$6.590

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Corphita

USA . 531 parts In-Stock

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$6.982

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$6.982

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Continental Prestige Electronics

USA . 99 parts In-Stock

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$11.440

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$8.510

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Advanced Electronics

New Zealand . 292 parts In-Stock

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$13.049

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$13.049

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$13.049

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$13.049

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Aztec Data Supply Inc.

USA . 818 parts In-Stock

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$15.450

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$15.450

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Corohmni

South Africa . 503 parts In-Stock

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$17.526

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$17.526

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Netroflash

USA . 2,000 parts In-Stock

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$8.787

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$8.518

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$8.338

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$8.787

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$8.338

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Argo Parts USA

USA . 842 parts In-Stock

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Overview

Discover the innovative ZGM130S037HGN2 by Silicon Labs, a top-quality telecom interface IC that promises unmatched performance and reliability. With its advanced technology and superior manufacturing process, Silicon Labs ensures this product meets the highest industry standards. This versatile chip carrier is perfect for a wide range of applications, offering customers seamless connectivity and optimal functionality. Experience the value and benefits of the ZGM130S037HGN2, designed to exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this product suitable for automated production processes.

Package Shape: SQUARE

The square package shape can help optimize space on a circuit board and promote efficient layout designs.

No. of Terminals: 64

Having a high number of terminals allows for complex functionalities and connections, making this product versatile and customizable.

Package Style: CHIP CARRIER

Chip carrier packages provide protection to the internal components and enhance durability, ensuring reliable performance under various conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure stable operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in cold environments, expanding its range of applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easy connections and enhances signal integrity, making this product suitable for high-speed communication applications.

Maximum Seated Height: 1.3 mm

The low seated height helps reduce the overall profile of the device, enabling compact designs and efficient space utilization on circuit boards.

Width: 9 mm

The narrow width of this product allows for flexibility in designing compact electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 40

The short peak reflow time minimizes the risk of thermal damage to sensitive components during the manufacturing process, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables the product to withstand the reflow soldering process, ensuring secure and reliable solder joints.

Length: 9 mm

The compact length of this product allows for efficient space utilization on circuit boards, enabling streamlined designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in a wide range of operating environments, making this product suitable for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability in manufacturing practices.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers specialized functionalities for telecommunications applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement enhances energy efficiency and reduces power consumption in electronic devices utilizing this product.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density interconnection and efficient signal routing, making this product suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to maintain product reliability.

Technical Specifications

Other Function Telecom Interface ICs ZGM130S037HGN2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs

Specs

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

ZGM130S037HGN2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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