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SI8440BB-D-IS1

Silicon Labs

SI8440BB-D-IS1 by Silicon Labs

SI8440BB-D-IS1 by Silicon Labs is a small outline interface IC with 16 terminals. It features CMOS technology, GULL WING terminals, and a rectangular package shape. Ideal for automotive applications due to its low seated height of 1.75mm and surface mount capability.

Median Price

$3.507

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,248 parts In-Stock

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Verical

USA . 1,248 parts In-Stock

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$3.507

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$5.152

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10

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Digiode

USA . 478 parts In-Stock

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$5.500

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Vyrian

USA . 6 parts In-Stock

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Semicontronic

India . 6 parts In-Stock

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$4.920

100+ parts

$4.797

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$4.772

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Continental Prestige Electronics

USA . 3,750 parts In-Stock

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$5.152

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$5.049

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Bastille Electronics

Australia . 10 parts In-Stock

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$5.152

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$4.894

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$4.650

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$4.585

10

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$4.585

Corphita

USA . 933 parts In-Stock

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$5.211

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Aztec Data Supply Inc.

USA . 764 parts In-Stock

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$6.105

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Corohmni

South Africa . 330 parts In-Stock

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Advanced Electronics

New Zealand . 56 parts In-Stock

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$10.710

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AZTECH Wire

Italy . 617 parts In-Stock

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$19.760

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Argo Parts USA

USA . 4,295 parts In-Stock

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Perfect Parts

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Overview

Upgrade your electronics with the SI8440BB-D-IS1 by Silicon Labs, a top-tier manufacturer known for producing high-quality Other Function Interface ICs. This innovative product offers seamless integration and reliability in various applications. Experience the exceptional value and benefits of this compact interface circuit, designed with automotive-grade technology for optimal performance. Trust Silicon Labs to deliver cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto PCBs, reducing assembly time and costs.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to integrate into existing PCB layouts.

No. of Terminals: 16

16 terminals provide ample connection points for interfacing with other components or systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs, ideal for compact designs or applications with limited board space.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options, enhancing versatility.

Maximum Seated Height: 1.75 mm

Low profile with a maximum seated height of 1.75 mm is beneficial for designs requiring slim form factors.

Width: 3.9 mm

Narrow width of 3.9 mm saves space on PCBs and enables closer placement of components for efficient board layout.

Length: 9.9 mm

Compact length of 9.9 mm contributes to the overall small size of the product, suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable performance in harsh operating conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: GULL WING

Gull wing terminal form is well-suited for surface mount applications, providing secure connections and ease of soldering.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27 mm allows for high-density mounting and space-efficient PCB designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, this product facilitates communication between different components or systems, making it a reliable choice for interface applications.

Technical Specifications

Other Function Interface ICs SI8440BB-D-IS1 attributes and parameters. Explore more Other Function Interface ICs devices from Silicon Labs

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SI8440BB-D-IS1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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