Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Semtech's GS2962-IBE3 is a telecom IC with data rate of 2970 Mbps. It operates at -20 to 85°C, with terminal pitch of 1mm and nominal voltage of 1.2V. Ideal for telecom applications requiring high-speed data transmission in compact spaces.
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Plastic/epoxy material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.
Surface mount capability makes installation easier and more efficient, saving time and effort during assembly.
Square package shape allows for efficient use of space on PCBs, optimizing layout and design.
Having 100 terminals allows for a high level of connectivity and functionality within the IC.
Grid array, low profile package style offers a compact design while still providing a high level of performance.
High maximum operating temperature ensures reliability and stability even in challenging thermal conditions.
Low minimum operating temperature allows for operation in colder environments without performance degradation.
Terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance for reliable connections.
Bottom terminal position facilitates easy installation and connection to other components within the system.
Low maximum seated height helps to reduce overall profile of the IC, particularly beneficial in space-constrained applications.
Compact width dimension allows for efficient use of space on PCBs, enabling more components to be packed closely together.
Short maximum time at peak reflow temperature helps to prevent overheating and damage during the assembly process.
High peak reflow temperature ensures proper soldering and connection integrity during the assembly process.
Compact length dimension contributes to overall space-saving and efficient PCB layout.
Ball terminal form provides reliable and secure connections for improved performance and durability.
Specifically designed for telecom applications, ensuring compatibility and optimized performance in telecommunications systems.
Low nominal supply voltage helps to reduce power consumption and improve efficiency in operation.
Narrow terminal pitch allows for dense packing of terminals, maximizing connectivity in a limited space.
High data rate capability enables fast and efficient data transfer, critical for telecom applications with high bandwidth requirements.
MSL level 3 indicates that the IC has a moderate level of moisture sensitivity, requiring proper handling and storage to maintain functionality.
Other Function Telecom Interface ICs GS2962-IBE3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Semtech
Data Rate:
JESD-30 Code:
JESD-609 Code:
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GS2962-IBE3 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Plating Process Change 03/Feb/2023
PCN Assembly/Origin - GS16x/GS29x 21/Apr/2022
PCN Packaging - Label Changes 28/Jun/2019
Semtech Corporation is a high-performance semiconductor, IoT systems and Cloud connectivity service provider dedicated to delivering high quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are dedicated to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. Since our founding in 1960 as a manufacturer of high reliability products, Semtech has grown to become a multinational technology innovator, enabling solutions that fuel a safer, more productive, more sustainable, and socially focused planet. We leverage our highly skilled teams to develop new products that solve some of the world’s most complex design challenges, making a positive and significant impact in our lives and environment.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
General Semiconductor
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
ISL32179EFRZ
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
ESP32-WROOM-32U
Espressif Systems (Shanghai)
ESP32-WROOM-32U by Espressif Systems (Shanghai) is a surface-mount telecom IC with 38 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This rectangular microelectronic assembly, with no lead terminal form, is ideal for telecom circuit applications due to its compact size (18mm x 19.2mm) and high peak reflow temperature (260°C).
RN52-I/RM
Microchip Technology
Microchip Technology's RN52-I/RM is a rectangular package IC with 40 terminals, 2.7mm height, and dimensions of 13.5mm x 26mm. It operates at a data rate of 3 Mbps and is used in telecom circuits for various applications requiring surface mount technology.
RN4870-I/RM128
RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.
TDA7116FHTMA1
Infineon Technologies
TDA7116FHTMA1 by Infineon is a telecom IC with 10 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and dual terminal position. This IC is suitable for telecom circuits requiring a nominal voltage of 3V in industrial temperature environments.
BMD-330-A-R
U-blox Ag
The U-blox Ag BMD-330-A-R is a surface mount telecom IC with 2 Mbps data rate. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Its rectangular package style and no lead terminal form make it ideal for microelectronic assemblies.
SA602AD/01,112
NXP Semiconductors
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
NEO-M8Q-0
NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.
LBEE5KL1YN-814
Murata Manufacturing
TELECOM CIRCUIT;
NEO-M8N-0-10
NEO-M8N-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With a supply voltage of 3V, it's ideal for industrial applications requiring AEC-Q100 screening and MSL level 4 moisture sensitivity. Measuring 12.2mm x 16mm in a rectangular package style, it offers precise positioning capabilities in compact designs.
BT8510EPJC
Conexant Systems
Conexant Systems' BT8510EPJC is a CMOS telecom IC with 68 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, requiring 5V supply voltage and drawing 0.1mA current. Ideal for CEPT PCM-30/E-1 applications, it features tin/lead terminal finish and quad position.
LM2893M
National Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
MAX-M8Q
ZM3102AE-CME1
Silicon Labs
ZM3102AE-CME1 by Silicon Labs is a surface mount telecom IC with 1 function and 18 terminals. It has a data rate of 0.04 Mbps and is used in telecom circuits.
ATWILC3000-MR110UA
ATWILC3000-MR110UA by Microchip Technology is a telecom IC with 36 terminals, operating at 3.3V. It offers a data rate of 65 Mbps and operates b/w -40 to 85°C. Ideal for applications requiring high-speed wireless communication in compact devices.
BT840E
Fanstel
BT840E by Fanstel is a telecom IC with 61 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and runs on a nominal voltage of 3.3V. Ideal for applications requiring high-speed telecommunications in compact devices due to its small form factor and surface-mount capability.
LBEE5KL1DX-883
Murata Manufacturing's LBEE5KL1DX-883 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 46 terminals. Operating from -30 to 70°C, it has a seated height of 1.1mm and nominal voltage of 3.6V. Ideal for TELECOM CIRCUITS, this Telecom Interface IC is surface mountable and suited for various telecom applications.
CC1125RHBT
CC1125RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 3V. It has a data rate of 0.2 Mbps and can withstand temperatures from -40 to 85°C. This chip carrier package is ideal for industrial telecom applications requiring a compact design and surface mount capability.
ZED-F9P-01B-01
Other Telecom ICs;
WL1837MODGIMOCT
WL1837MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for industrial applications requiring high-speed communication in compact spaces.
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GS2972-IBE3
Semtech
Semtech's GS2972-IBE3 is a telecom IC with 100 terminals in a square package. It operates b/w -20°C to 85°C, with a low profile grid array style. Featuring TIN SILVER COPPER finish, it has a 1.2V supply voltage and is ideal for telecom interface applications.
GS2988-INE3
Semtech's GS2988-INE3 is a BICMOS telecom IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it has a supply voltage of 2.5V and peak reflow temp of 260°C. Ideal for telecom circuits, it features matte tin terminal finish and very thin profile for industrial applications.
GS2971-IBE3
Semtech's GS2971-IBE3 is a telecom IC with 100 terminals in a square grid array package. Operating temp range -20 to 85°C, terminal pitch of 1mm, and nominal voltage of 1.2V make it ideal for telecom circuit applications. The low-profile design with tin silver copper finish and ball terminal form ensures reliable performance.
GS2971AIBE3
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
GS2971AIBTE3
GS2960-IBE3
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
GS2960AIBE3
GS2960AIBTE3
GS2962-IBTE3
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
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