Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Sandisk SDIN9DS2-8G is a secondary storage controller with max supply voltage of 3.6V and max data transfer rate of 250MBps. Ideal for flash memory drives, it operates b/w -25 to 85°C temperatures, making it suitable for various applications requiring high-speed data processing.
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Surface mount technology allows for easy and convenient installation on printed circuit boards, saving space and making the product suitable for compact designs.
The high maximum supply voltage ensures reliable and stable operation of the secondary storage controller, even under variable voltage conditions.
The rectangular package shape allows for efficient use of space on the PCB and easy integration into various electronic systems.
The low minimum supply voltage enables the secondary storage controller to operate efficiently even with low power sources, enhancing its versatility.
With a high maximum operating temperature, this secondary storage controller can reliably operate in a wide range of environmental conditions without overheating.
The low minimum operating temperature ensures that the secondary storage controller can function effectively even in cold environments or during startup.
The upper terminal position facilitates easy connection and compatibility with standard PCB layouts, improving overall ease of use and installation.
This peripheral IC type indicates that the product is designed specifically for secondary storage control and flash memory drive applications, making it a specialized and reliable choice for these purposes.
CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making this secondary storage controller energy-efficient and versatile.
The high maximum data transfer rate allows for rapid and efficient data transmission between the secondary storage controller and the host system, ensuring fast performance and responsiveness.
Secondary Storage Controllers SDIN9DS2-8G attributes and parameters. Explore more Secondary Storage Controllers devices from Sandisk
Maximum Host Data Transfer Rate:
JESD-30 Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Supply Voltage:
Minimum Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
Peripheral IC Type:
SDIN9DS2-8G Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Boca Semiconductor
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
Lite-on Semiconductor
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Fairchild Semiconductor
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
Hy Electronic
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
THGBMFG8C4LBAIR
Toshiba
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR;
UPD7261D
Renesas Electronics
Secondary Storage Controllers; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
MTFDDAV960TDS-1AW1ZABYY
Micron Technology
Secondary Storage Controllers;
MTFDDAY512MBF-1AN1ZABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 75; Package Code: DIE; Package Shape: RECTANGULAR;
THNSNH512GBST
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Technology: CMOS;
UPD72061L
Secondary Storage Controllers; Terminal Form: J BEND; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;
MTFDDAV256TBN-1AR1ZABYY
MTFDDAK064MAM-1J11AA
MTFDDAT064MBD-AAH12ITYYES
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE;
MTFDDAT240MBD-1AK12ITYY
MTFDDAK960TDS-1AW15ABYY
MZ7PA064HMCD-010
Samsung
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Maximum Host Data Transfer Rate: 300 MBps; Maximum Operating Temperature: 70 Cel;
UPD72065GC
Secondary Storage Controllers; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE;
MTFDDAK064MAM-1J11AB
HN29W256SH01TE-1
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 120; Package Code: QFP; Package Shape: SQUARE;
MTFDDAK512TBN-1AR12ABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Technology: CMOS;
THNID2G04BBI
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 40; Package Shape: UNSPECIFIED; Nominal Supply Voltage: 5 V;
MTFDDAV480TBY-1AR16ABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Peak Reflow Temperature (C): NOT SPECIFIED; Technology: CMOS; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
UPD72069L
Secondary Storage Controllers; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
TC8569AF(R)
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.05 mm;
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SDIN7DU2-16G-T
Sandisk
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR;
SDIN8DE1-8G-XI
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.3 V;
SDIN2C2-2G
Western Digital
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR;
SDIN2C2-2G-T
SDIN7DP4-16G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N;
SDIN8CE4-64G-XI
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
SDINADF4-128G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
SDINADF4-32G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
SDIN8DE1-8G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Package Style (Meter): UNCASED CHIP;
SDIN7DU2-16G-I
SDIN8DE4-32G-XI
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Position: UPPER;
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
SDIN9DS2-16G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES;
SDIN8DE4-64G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Supply Voltage: 2.7 V;
SDINADB4-16G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Host Data Transfer Rate: 280 MBps;
SDIN9DS2-32G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Technology: CMOS;
SDIN9DS2-64G
SDIN8DE2-8G
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Position: UPPER;
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Maximum Host Data Transfer Rate: 290 MBps;
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