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CY7C68023-56LTXC

Infineon Technologies

CY7C68023-56LTXC by Infineon Technologies

Infineon's CY7C68023-56LTXC is a Secondary Storage Controller with USB interface, operating at 3.3V. It features a max supply voltage of 3.6V, operates b/w 0-70°C, and comes in a square package style with 56 terminals for flash memory drives.

Median Price

$23.524

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 8,421 parts In-Stock

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Rochester

USA . 685 parts In-Stock

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$20.910

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$18.710

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$17.610

685

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$18.710

$17.610

Verical

USA . 685 parts In-Stock

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-

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$26.137

1k+ parts

$23.387

10k+ parts

$22.012

685

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$26.137

$23.387

$22.012

DigiKey

USA . 9 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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$21.459

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900

$21.459

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Digiode

USA . 666 parts In-Stock

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$22.126

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666

$22.126

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Vyrian

USA . 2,536 parts In-Stock

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2,536

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Flip Electronics

USA . 2,421 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 219 parts In-Stock

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Bristol Electronics

USA . 219 parts In-Stock

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Dan-Mar Components

USA . 219 parts In-Stock

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DigiKey Marketplace

USA . 36 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,591 parts In-Stock

1+ parts

$19.800

100+ parts

$19.305

1k+ parts

$19.206

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2,591

$19.800

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$19.206

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Corphita

USA . 558 parts In-Stock

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$20.961

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558

$20.961

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Continental Prestige Electronics

USA . 1,514 parts In-Stock

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$21.459

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$21.030

1,514

$21.459

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$21.030

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$21.460

100+ parts

$20.387

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$19.099

10

$21.460

$20.387

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$19.099

Component Stockers USA

USA . 22 parts In-Stock

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$23.910

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22

$23.910

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Aztec Data Supply Inc.

USA . 3,384 parts In-Stock

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$24.027

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3,384

$24.027

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Modulus Dynamics

Lithuania . 3,983 parts In-Stock

1+ parts

$32.440

100+ parts

$31.142

1k+ parts

$29.845

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3,983

$32.440

$31.142

$29.845

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Ampacity Inc.

Singapore . 2,484 parts In-Stock

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$43.090

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2,484

$43.090

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Microchip USA

USA . 348 parts In-Stock

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$51.428

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348

$51.428

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Corohmni

South Africa . 1,973 parts In-Stock

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$55.740

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$55.740

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Lixinc

USA . 1,447 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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$1.835

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$1.835

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$1.835

900

-

$1.835

$1.835

$1.835

Lucentia Tech

USA . 900 parts In-Stock

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$1.835

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$1.835

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$1.835

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$1.835

$1.835

$1.835

A-Z Elektronik GmbH

Germany . 714 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Kepictronics

USA . 52 parts In-Stock

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iodParts Technologies Inc.

India . 20 parts In-Stock

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ChipstoGo Electronic ltd

UK . 7 parts In-Stock

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Overview

Unlock seamless data storage and transfer with the CY7C68023-56LTXC by Infineon Technologies, a leading manufacturer in the industry. Ideal for secondary storage controllers, this product boasts a compact size, high performance, and reliability. With a host interface standard of USB, this device offers convenience and ease of use for various applications. Trust in the quality and innovation of Infineon Technologies to elevate your storage solutions to the next level. Experience the difference with CY7C68023-56LTXC.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, making it ideal for space-saving applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this secondary storage controller can handle higher power requirements and operate efficiently.

Package Shape: SQUARE

The square package shape provides extra stability and compatibility with various devices, ensuring a reliable connection.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and power sources, making it versatile and practical.

No. of Terminals: 56

With a high number of terminals, this controller offers plenty of connectivity options for peripherals and external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles ensures optimal performance and heat dissipation, making it suitable for demanding applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 70 °C

This high operating temperature range ensures reliability in harsh environments and under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides durability and corrosion resistance for long-lasting use.

Terminal Position: QUAD

The quad terminal position offers secure and stable connections for reliable data transfer and communication.

Maximum Seated Height: 1 mm

The low profile design with a maximum seated height of 1mm allows for compact and space-efficient installation in tight spaces.

Width: 8 mm

The 8mm width ensures compatibility with standard slots and connectors, making it easy to integrate into existing systems.

Maximum Time At Peak Reflow Temperature (s): 20

This feature allows for quick and efficient soldering during installation, reducing downtime and ensuring a reliable connection.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and connection during installation, making it suitable for industrial applications.

Length: 8 mm

The 8mm length provides a compact yet efficient design, making it suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

This temperature grade ensures compatibility with standard operating conditions, making it suitable for commercial and consumer use.

Peripheral IC Type: SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

This versatile controller can handle various peripheral devices and data storage requirements, providing flexibility and convenience for different applications.

Host Interface Standard: USB

The USB host interface standard allows for easy and quick connection to various devices, ensuring compatibility and reliability.

Technology: CMOS

The CMOS technology offers low power consumption and high efficiency, making it a cost-effective and reliable choice for secondary storage control.

Terminal Form: NO LEAD

The no lead terminal form ensures environmentally-friendly construction and easy compatibility with modern soldering techniques.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides stable and consistent power for uninterrupted performance, making it a reliable choice for secondary storage control.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for efficient and space-saving connection, making it ideal for compact devices and applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this controller can withstand moderate exposure to moisture, ensuring reliability in various environments.

Technical Specifications

Secondary Storage Controllers CY7C68023-56LTXC attributes and parameters. Explore more Secondary Storage Controllers devices from Infineon Technologies

Specs

Host Interface Standard:

USB

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY7C68023-56LTXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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