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BU2302

ROHM

BU2302 by ROHM

PULSE; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 6,593 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,593

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-

S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

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Technical Specifications

Analog Waveform Generation BU2302 attributes and parameters. Explore more Analog Waveform Generation devices from ROHM

Specs

Additional Features:

Oscillation Frequency can be set freely using external CR

Other IC type:

JESD-30 Code:

R-PDIP-T8

Length:

9.3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Frequency:

1.17 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

3.7 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

BU2302 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

ROHM

Rohm Co Ltd is a Japan-based company that manufactures and distributes electronic components for use in automotive, transportation, medical, healthcare, audiovisual, telecommunications, digital power, computer and peripherals, and home appliance end markets. Its product portfolio includes integrated circuits in memory, amplifiers, switches, data converters, and microcontrollers; discrete semiconductors, such as transistors and diodes; power devices; passive devices, such as resistors and capacitors; and optoelectronic devices.

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