Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH;
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FIFO 72801L25TFGI8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
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72801L25TFGI8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
BAV99
National Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Surge Components
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
First Components International
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; Config: SINGLE; No. of Elements: 1;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Infineon Technologies
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
Weitronic Enterprise
IDT72V255LA10PFG8
IDT72V255LA10PFG8 by Renesas Electronics is a 3.3V FIFO with 8Kx18 organization, operating at 100MHz clock frequency. Suitable for commercial applications, it offers a cycle time of 10ns, synchronous operation, and parallel interface for efficient data transfer.
SN74ABT7819-10PH
Texas Instruments
SN74ABT7819-10PH by Texas Instruments is a 512x18 Bi-directional FIFO with 10ns cycle time, operating at up to 100MHz. It features a synchronous mode and operates on a 5V supply voltage. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT7202LA15RJ
SN74ACT7202LA15RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can be used in applications requiring fast asynchronous data transfer. With a memory density of 9216 bits, it is suitable for commercial temperature grade environments.
IDT7203L12J8
Integrated Device Technology
IDT7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, such as networking equipment and communication systems.
SN74ACT72211L-50RJ
SN74ACT72211L-50RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 20MHz. It has a cycle time of 50ns and supports synchronous operation. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
74HC40105PW,118
Nexperia
FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Access Time: 600 ns;
IDT7201LA12PDG
The Renesas Electronics IDT7201LA12PDG is a FIFO memory chip with 512x9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7201LA12JG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
7202LA25J8
7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
SN74ACT7201LA-25RJR
SN74ACT7201LA-25RJR by Texas Instruments is a FIFO chip with 512x9 organization, 35ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a nominal voltage of 5V. This chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT72V235L10TFG8
IDT72V235L10TFG8 by Renesas Electronics is a 2Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. Ideal for applications requiring fast data transfer and memory management in commercial temperature environments.
7204L15SOGI
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
IDT72V3650L6PFG8
IDT72V3650L6PFG8 by Renesas Electronics is a FIFO with 2Kx36 organization, operating at 166 MHz clock frequency. It features synchronous operation, 3.3V nominal voltage, and 6ns cycle time. Ideal for applications requiring high-speed data buffering and retrieval in commercial temperature environments.
72V255LA15PFI8
72V255LA15PFI8 by Integrated Device Technology is a FIFO with 8Kx18 organization, operating at 66.7MHz clock frequency and 15ns cycle time. It is suitable for industrial applications requiring fast data processing and synchronous operation in a compact flatpack package style.
SN74ABT7819A-30PN
SN74ABT7819A-30PN by Texas Instruments is a FIFO memory IC with 512Kx18 organization, operating at 33.3MHz cycle time. It features a 5V nominal voltage and synchronous operation mode, suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
7204L12JG8
Renesas Electronics 7204L12JG8 is a FIFO chip carrier with 4Kx9 organization, operating at 50 MHz clock frequency. It has a cycle time of 20 ns and supports parallel mode. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7819-10PNR
SN74ABT7819-10PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 10ns and synchronous operation, suitable for applications requiring fast data transfer and memory management in commercial-grade environments. The package style is flatpack with low profile and fine pitch, making it ideal for space-constrained designs.
5962-8986305YA
Teledyne E2v (uk)
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
SN74ACT72211L-50RJR
SN74ACT72211L-50RJR by Texas Instruments is a FIFO chip with 512x9 organization, operating at 5V. It features a cycle time of 50ns and max clock frequency of 20MHz, suitable for synchronous applications. This CMOS technology memory IC has a memory density of 4608 bits and supports parallel operation with output enable functionality.
IDT72V255LA10TFG8
IDT72V255LA10TFG8 by Renesas Electronics is a FIFO with 8Kx18 organization, operating at 100MHz. It features a cycle time of 10ns and synchronous mode, suitable for applications requiring fast data transfer such as networking equipment and telecommunications devices. The device has a low profile flatpack package with matte tin terminals, making it ideal for space-constrained designs in commercial temperature environments.
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7280L20PA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
72801L15PFG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Access Time: 10 ns;
72801L25TFGI
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
72801L15TFGI
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP64,.47SQ,20;
72801L25TFG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; No. of Words Code: 256;
72801L15TFG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Memory Density: 2304 bit;
72801L10PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 9;
72801L15PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Terminal Pitch: .8 mm;
72801L15TFGI8
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
72801L25PFG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
72801L25PFGI8
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Access Time: 15 ns;
72801L15PFGI8
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Organization: 512X9;
72801L25TFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
72801L10TFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Organization: 256X9;
72801L25PFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;
72801L15TFG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;
72801L10PFG
72801L10TFG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 4.5 V;
72801L15PFGI
BI-DIRECTIONAL FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72801L25TFI9
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Memory Width: 9;
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