Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIFOs; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3;
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FIFO 7207L12JG8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
7207L12JG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
1N4148WT-7
Diodes Incorporated
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hitachi
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
Bytesonic Electronics
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
Nte Electronics
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
Silicon Transistor
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SN74ABT7819-20PN
Texas Instruments
SN74ABT7819-20PN by Texas Instruments is a FIFO memory with 512x18 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, featuring a 3-STATE output characteristic and GULL WING terminal form for parallel communication.
SN74ACT2235-30PAG
SN74ACT2235-30PAG by Texas Instruments is a FIFO memory IC with 1Kx9 organization, operating at 30 ns cycle time and 33 MHz clock frequency. It features a 64-terminal flatpack package suitable for parallel applications. With a supply voltage of 5V, it offers fast access times and output enable functionality for efficient data storage and retrieval.
72V2105L10PFG
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74ACT3632-30PCB
Rochester Electronics
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
IDT7201LA12SOG8
Renesas Electronics
IDT7201LA12SOG8 by Renesas Electronics is a 512x9 FIFO with a cycle time of 20 ns. It operates in asynchronous mode and has a max access time of 12 ns. This device is commonly used in applications that require high-speed data buffering and storage.
SN74ACT2235-35FN
SN74ACT2235-35FN by Texas Instruments is a 2Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output, and a memory density of 18432 bits. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
1M7814-40DLG4
1M7814-40DLG4 by Texas Instruments is a FIFO with 64x18 organization, operating at 50 MHz. It has a cycle time of 40 ns and can handle a max clock frequency of 50 MHz. Ideal for applications requiring fast data processing in commercial temperature environments.
IDT7202LA35JG
IDT7202LA35JG by Renesas Electronics is a FIFO chip with 1Kx9 organization and 1024 words capacity. It operates asynchronously with a cycle time of 45ns, making it suitable for high-speed data buffering applications. The chip features 3-STATE output characteristics and supports parallel communication, ideal for systems requiring fast and efficient data storage and retrieval.
IDT72V215L15TFGI
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE; No. of Words Code: 512;
72V221L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Length: 7 mm;
SN74ABT7819-30PHR
SN74ABT7819-30PHR by Texas Instruments is a 512x18 FIFO with 30.03ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
IDT7202LA25TPI
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
72V05L25JGI8
The Renesas Electronics 72V05L25JGI8 FIFO chip features a cycle time of 35ns, operating at 3.3V with an organization of 8KX9. It is designed for industrial applications requiring fast parallel access times and a memory density of 73728 bits in a compact chip carrier package.
IDT7203L15PI
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
72V275L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Access Time: 6.5 ns;
SN74ABT7815-25PQ
SN74ABT7815-25PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with 40 MHz clock frequency, operating at 5V. It features synchronous operation, GULL WING terminals, and a max access time of 14ns. Ideal for applications requiring fast data transfer in commercial temperature environments.
7203L12J8
7203L12J8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and can handle memory width of 9 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7819A-10PN
SN74ABT7819A-10PN by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO with 10ns cycle time, operating at 100MHz. It features a 5V nominal voltage and GULL WING terminal form. Ideal for applications requiring fast data transfer and synchronization in commercial temperature environments.
SN74ACT3622-30PCBR
SN74ACT3622-30PCBR by Texas Instruments is a FIFO with 256x36 organization, 30 ns cycle time, and 5V nominal voltage. It operates synchronously in commercial temperature grade applications. This device features a parallel interface, 3-STATE output characteristics, and GULL WING terminal form for efficient data storage and retrieval.
IDT72V265LA15PFI8
IDT72V265LA15PFI8 FIFO by Integrated Device Technology features 16Kx18 organization, 15ns cycle time, and 66.7MHz clock frequency. Ideal for industrial applications requiring fast synchronous operation in a compact flatpack package with low profile design.
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7207L15PDGI
FIFOs;
7207L15JG8
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-609 Code: e3;
7207L12PDG
7207L15PDGG
BI-DIRECTIONAL FIFO;
7207L15JGI8
FIFOs; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30;
7207L15DGI8
7207L15TD
FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
7207L12DG8
7207L15JGI
FIFOs; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
7207L15DG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
7207L15PDG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
7207L15LG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
7207L15DGI
7207L15PDGG8
7207L15JG
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns;
7207L12DG
7207L12JG
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
7207L15DG8
7207L15LG8
BI-DIRECTIONAL FIFO; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp; JESD-30 Code: R-XQCC-N32;
FIFOs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3;
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