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5962-8986306XX

Qp Semiconductor

5962-8986306XX by Qp Semiconductor

FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.715 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

5962-8986306XX by Qp Semiconductor
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Technical Specifications

FIFO 5962-8986306XX attributes and parameters. Explore more FIFO devices from Qp Semiconductor

Specs

Maximum Access Time:

25 ns

Additional Features:

RETRANSMIT

Cycle Time:

35 ns

JESD-30 Code:

R-GDIP-T28

Length:

37.338 mm

Memory Density:

4608 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X9

Output Enable:

NO

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.715 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8986306XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Qp Semiconductor

P Semiconductor is a privately held California company incorporated in October 1985. QP Semiconductor was formed initially to provide semiconductor assembly, electrical test and qualification services to the military, aerospace and high reliability industries. The company has since evolved into a true fabless semiconductor company with a complete range of manufacturing capability by establishing product design and fab foundry relationships to complement its assembly, test and qualification capability. The products and services offered, focus on providing total parts solutions for DMS, (Diminished Manufacturing Sources) and EOL (End of Life) semiconductor components to the military, aerospace and high reliability markets. QP Semiconductor was acquired by British company e2v in October, 2008.

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