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PCF8570CP

Philips Semiconductors

PCF8570CP by Philips Semiconductors

STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;

Median Price

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Lifecycle Status

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Vyrian

USA . 4,301 parts In-Stock

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Digiode

USA . 3,424 parts In-Stock

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Anansix

USA . 525 parts In-Stock

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One Stop Electronics

USA . 953 parts In-Stock

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$12.000

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953

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Corphita

USA . 3,532 parts In-Stock

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UNI Independent Distributors

Spain . 3,245 parts In-Stock

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Technical Specifications

SRAM PCF8570CP attributes and parameters. Explore more SRAM devices from Philips Semiconductors

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Ports:

1, (2 LINE)

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Standby Current:

.0000004 Amp

Minimum Standby Voltage:

1 V

Sub-Category:

SRAMs

Maximum Supply Current:

.2 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

PCF8570CP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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