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BGD712C

Philips Semiconductors

BGD712C by Philips Semiconductors

RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Maximum Supply Current: 410 mA; Power Supplies (V): 24; Package Equivalence Code: SOT-115J; Minimum Operating Temperature: -20 Cel;

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Lifecycle Status

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In-Stock Inventory

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Digiode

USA . 3,369 parts In-Stock

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Anansix

USA . 1,207 parts In-Stock

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Vyrian

USA . 75 parts In-Stock

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Carlin Systems, Inc.

USA . 1 parts In-Stock

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One Stop Electronics

USA . 1,571 parts In-Stock

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$21.000

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Authorized Procurement Solutions

USA . 10,500 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

Germany . 5,568 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,712 parts In-Stock

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Corphita

USA . 2,494 parts In-Stock

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Northwest PG Solutions

USA . 2,203 parts In-Stock

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Native Components

USA . 271 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 84 parts In-Stock

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Technical Specifications

RF & Microwave Amplifiers BGD712C attributes and parameters. Explore more RF & Microwave Amplifiers devices from Philips Semiconductors

Specs

No. of Functions:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

SOT-115J

Power Supplies (V):

24

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

410 mA

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

Category top products 20

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