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82S126/BFA

Philips Semiconductors

82S126/BFA by Philips Semiconductors

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Package Style (Meter): FLATPACK;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,299 parts In-Stock

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2,299

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Digiode

USA . 1,957 parts In-Stock

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1,957

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Vyrian

USA . 29 parts In-Stock

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29

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Native Components

USA . 685 parts In-Stock

1+ parts

$10.885

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685

$10.885

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Northwest PG Solutions

USA . 261 parts In-Stock

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$11.973

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$10.776

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261

$11.973

$10.776

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One Stop Electronics

USA . 483 parts In-Stock

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$29.000

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483

$29.000

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UNI Independent Distributors

Spain . 7,324 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,458 parts In-Stock

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2,458

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Technical Specifications

OTP ROM 82S126/BFA attributes and parameters. Explore more OTP ROM devices from Philips Semiconductors

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-XDFP-F16

JESD-609 Code:

e0

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X4

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Maximum Supply Current:

125 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

FLAT

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

82S126/BFA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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