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74LVC1G19GW

Philips Semiconductors

74LVC1G19GW by Philips Semiconductors

OTHER DECODER/DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 34,590 parts In-Stock

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Bristol Electronics

USA . 7,435 parts In-Stock

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Inventory MP

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Dan-Mar Components

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Vyrian

USA . 2,156 parts In-Stock

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Digiode

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Anansix

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Native Components

USA . 986 parts In-Stock

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$0.053

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$0.051

986

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AZTECH Wire

Italy . 9,007 parts In-Stock

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$5.510

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One Stop Electronics

USA . 1,394 parts In-Stock

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Kepictronics

USA . 48,000 parts In-Stock

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Metaverse IC Inc.

Canada . 15,890 parts In-Stock

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UNI Independent Distributors

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S.R.D Solutions

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Corphita

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GreenTree Electronics

Israel . 1,912 parts In-Stock

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Supply Digital

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Northwest PG Solutions

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Robosynatics

Brazil . 300 parts In-Stock

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$9.474

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Lucentia Tech

USA . 300 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20 parts In-Stock

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Technical Specifications

Decoder & Drivers 74LVC1G19GW attributes and parameters. Explore more Decoder & Drivers devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Qualification:

Not Qualified

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74LVC1G19GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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