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74AHCT1G125GV

Philips Semiconductors

74AHCT1G125GV by Philips Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSOP; Package Shape: RECTANGULAR;

Median Price

$0.094

Lifecycle Status

Suppliers In-Stock

9

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Chip Stock

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

Germany . 1,686 parts In-Stock

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Bristol Electronics

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Cyclops Electronics Ltd

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Distributors (Availability)

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Component Stockers USA

USA . 1,831 parts In-Stock

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AZTECH Wire

Italy . 5,259 parts In-Stock

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Andel Nordic

Denmark . 209 parts In-Stock

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$4.907

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One Stop Electronics

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Native Components

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Northwest PG Solutions

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iodParts Technologies Inc.

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Glotronic Ltd.

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Supply Digital

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Assy Fe

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Corphita

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Technical Specifications

Bus Driver & Transceivers 74AHCT1G125GV attributes and parameters. Explore more Bus Driver & Transceivers devices from Philips Semiconductors

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

74AHCT1G125GV Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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