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SVD5806NT4G

Onsemi

SVD5806NT4G by Onsemi

SVD5806NT4G by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 67A and EAS of 39mJ, operating in ENHANCEMENT MODE. This small outline transistor has a max ID of 33A, 0.019 ohm RDS(on), and can withstand temperatures from -55 to 175 °C.

Median Price

$0.412

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$0.412

100+ parts

$0.388

1k+ parts

$0.350

10k+ parts

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2,500

$0.412

$0.388

$0.350

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Distributors (In-Stock)

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Digiode

USA . 938 parts In-Stock

1+ parts

$0.391

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938

$0.391

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Flip Electronics

USA . 75,000 parts In-Stock

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75,000

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Vyrian

USA . 6,048 parts In-Stock

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6,048

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Distributors (Availability)

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Corphita

USA . 979 parts In-Stock

1+ parts

$0.371

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979

$0.371

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Corohmni

South Africa . 338 parts In-Stock

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$0.412

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338

$0.412

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AZTECH Wire

Italy . 756 parts In-Stock

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$9.460

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756

$9.460

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Problanco Electronics

Mexico . 8,221 parts In-Stock

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8,221

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SupplyDigital Components

Austria . 7,207 parts In-Stock

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Kulean Microsystems

USA . 5,684 parts In-Stock

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5,684

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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811

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TANS Electronics

Latvia . 54 parts In-Stock

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Overview

Unlock the power of innovation with the Onsemi SVD5806NT4G Power Field Effect Transistor. Crafted with precision by leading manufacturer Onsemi, this N-CHANNEL transistor offers enhanced performance and reliability for a variety of switching applications. With a built-in diode and high-quality construction, this transistor ensures seamless operation and efficient power management. Experience the benefits of advanced technology with the SVD5806NT4G, designed to exceed your expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can provide additional functions such as reverse current protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power control.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle higher voltage levels without experiencing failure.

Maximum Pulsed Drain Current (IDM): 67 A

The high pulsed drain current rating of 67 A allows for reliable performance in applications that require high current handling capabilities.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can withstand high-temperature environments without degradation in performance.

Maximum Drain-Source On Resistance: 0.019 ohm

The low on-resistance of 0.019 ohm results in reduced power losses and improved efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) SVD5806NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

39 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

67 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SVD5806NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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