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P5P2304AF-2-08ST

Onsemi

P5P2304AF-2-08ST by Onsemi

P5P2304AF-2-08ST Clock Driver by Onsemi is a CMOS technology device with 8 terminals, operating at 3.3V. It has a max I (ol) of 8A and can withstand temperatures from 0 to 70 °C. Ideal for applications requiring precise clock signal distribution in commercial-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,099 parts In-Stock

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Vyrian

USA . 485 parts In-Stock

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Problanco Electronics

Mexico . 7,956 parts In-Stock

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SupplyDigital Components

Austria . 7,254 parts In-Stock

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Kulean Microsystems

USA . 4,081 parts In-Stock

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Corphita

USA . 2,302 parts In-Stock

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TANS Electronics

Latvia . 1,867 parts In-Stock

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UHIMA Technologies

Türkiye . 581 parts In-Stock

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Corohmni

South Africa . 151 parts In-Stock

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Overview

Looking for a reliable Clock Driver & Buffer for your next project? Look no further than the P5P2304AF-2-08ST by Onsemi. With a reputation for quality and innovation, Onsemi delivers top-notch products that exceed industry standards. This versatile component is perfect for a wide range of applications, offering customers unmatched value and performance. Trust Onsemi to provide the solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and making it suitable for automated manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a lower voltage of 3.3V results in lower power consumption and heat generation, leading to better energy efficiency.

Maximum I (ol): 8 Amp

The high maximum output current of 8 Amp allows the device to drive multiple loads effectively, making it versatile and suitable for various applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand high temperatures without compromising performance, ensuring reliability in harsh environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the product efficient and reliable.

Technical Specifications

Clock Drivers & Buffers P5P2304AF-2-08ST attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Maximum I (ol):

8 Amp

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

P5P2304AF-2-08ST Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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