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P5P2308AF-1H16TR

Onsemi

P5P2308AF-1H16TR by Onsemi

P5P2308AF-1H16TR clock driver by Onsemi operates at 3.3V, with 8 true outputs and a max frequency of 133MHz. It is used in applications requiring MUX input conditioning, with a small outline package suitable for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,776 parts In-Stock

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Vyrian

USA . 1,722 parts In-Stock

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Kulean Microsystems

USA . 6,595 parts In-Stock

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SupplyDigital Components

Austria . 5,276 parts In-Stock

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TANS Electronics

Latvia . 4,188 parts In-Stock

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Problanco Electronics

Mexico . 1,949 parts In-Stock

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Corphita

USA . 1,055 parts In-Stock

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Corohmni

South Africa . 254 parts In-Stock

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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Overview

Unlock unprecedented performance and reliability with the P5P2308AF-1H16TR by Onsemi, a cutting-edge clock driver & buffer designed to meet the highest industry standards. Manufactured by Onsemi, a renowned leader in semiconductor technology, this product guarantees superior quality and unmatched precision. Ideal for a wide range of applications, this versatile device offers customers seamless integration, optimal functionality, and exceptional value. Elevate your projects with the P5P2308AF-1H16TR and experience the next level of performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for compact and portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs, saving space and improving overall product reliability.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the outputs, allowing for efficient signal routing and power management.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage makes it compatible with a wide range of electronic systems and applications, ensuring easy integration.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C ensures reliable performance in various environmental conditions, making it suitable for diverse use cases.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand elevated temperatures without compromising functionality, ensuring long-term durability.

No. of True Outputs: 8

Having 8 true outputs allows for efficient signal distribution and processing, making the product suitable for complex clock driving applications with multiple output requirements.

Technical Specifications

Clock Drivers & Buffers P5P2308AF-1H16TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2308

Input Conditioning:

MUX

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Same Edge Skew (tskwd):

.2 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Minimum fmax:

133 MHz

Trade Compliance

P5P2308AF-1H16TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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