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NXH80B120MNQ0SNG

Onsemi

NXH80B120MNQ0SNG by Onsemi

NXH80B120MNQ0SNG by Onsemi is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. Featuring common drain configuration, it has 2 elements with built-in diode and operates in enhancement mode. With a max pulsed drain current of 69A and max power dissipation of 69W, this MOSFET is designed for high-power applications.

Median Price

$58.470

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 24 parts In-Stock

1+ parts

$56.300

100+ parts

$48.560

1k+ parts

-

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24

$56.300

$48.560

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Arrow

USA . 3 parts In-Stock

1+ parts

$56.796

100+ parts

$26.010

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-

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3

$56.796

$26.010

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-

Farnell

UK . 14 parts In-Stock

1+ parts

$58.470

100+ parts

$50.020

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-

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14

$58.470

$50.020

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Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$67.350

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37

$67.350

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DigiKey

USA . 48 parts In-Stock

1+ parts

$67.950

100+ parts

$51.886

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-

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48

$67.950

$51.886

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Element14

Singapore . 14 parts In-Stock

1+ parts

$98.240

100+ parts

$84.020

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-

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14

$98.240

$84.020

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Flip Electronics (Authorized)

USA . 6,336 parts In-Stock

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6,336

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Verical

USA . 1,176 parts In-Stock

1+ parts

-

100+ parts

$64.850

1k+ parts

$58.025

10k+ parts

$54.612

1,176

-

$64.850

$58.025

$54.612

Rochester

USA . 1,176 parts In-Stock

1+ parts

-

100+ parts

$51.880

1k+ parts

$46.420

10k+ parts

$43.690

1,176

-

$51.880

$46.420

$43.690

EBV Elektronik

Germany . 192 parts In-Stock

1+ parts

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192

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Future Electronics

Canada . 24 parts In-Stock

1+ parts

-

100+ parts

$53.270

1k+ parts

$52.830

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24

-

$53.270

$52.830

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 637 parts In-Stock

1+ parts

$62.026

100+ parts

-

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637

$62.026

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IBS Electronics

USA . 24 parts In-Stock

1+ parts

$76.422

100+ parts

$73.323

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24

$76.422

$73.323

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Flip Electronics

USA . 6,336 parts In-Stock

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6,336

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Vyrian

USA . 2,784 parts In-Stock

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2,784

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TME

Poland . 600 parts In-Stock

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$66.190

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600

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$66.190

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NAC Semi

USA . 48 parts In-Stock

1+ parts

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$98.050

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48

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$98.050

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,859 parts In-Stock

1+ parts

$58.761

100+ parts

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1,859

$58.761

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Corohmni

South Africa . 455 parts In-Stock

1+ parts

$65.290

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455

$65.290

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Microchip USA

USA . 3,387 parts In-Stock

1+ parts

$204.194

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3,387

$204.194

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Problanco Electronics

Mexico . 7,753 parts In-Stock

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7,753

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Kulean Microsystems

USA . 5,983 parts In-Stock

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5,983

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TANS Electronics

Latvia . 5,232 parts In-Stock

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SupplyDigital Components

Austria . 1,336 parts In-Stock

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1,336

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UHIMA Technologies

Türkiye . 609 parts In-Stock

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609

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Overview

Unleash the power of innovation with the NXH80B120MNQ0SNG by Onsemi! As a leading manufacturer of Power Field Effect Transistors, Onsemi delivers cutting-edge technology and unparalleled quality. This N-CHANNEL transistor is perfect for applications requiring high efficiency switching. With a maximum DS Breakdown Voltage of 1200V and Maximum Pulsed Drain Current of 69A, this transistor offers superior performance and reliability. Experience the value and benefits of the NXH80B120MNQ0SNG for your next project!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their higher electron mobility, making them more efficient for switching applications.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage ensures the FET can handle high voltage applications without breakdown, ensuring reliability.

Maximum Pulsed Drain Current (IDM): 69 A

High pulsed drain current capability allows for handling sudden spikes in current without damage to the FET.

Maximum Power Dissipation (Abs): 69 W

High power dissipation capability enables the FET to handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the FET to be used in various environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NXH80B120MNQ0SNG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X22

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

22

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

69 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NXH80B120MNQ0SNG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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