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NVT210CDM3R2G

Onsemi

NVT210CDM3R2G by Onsemi

NVT210CDM3R2G by Onsemi is a Power Management IC with 8 terminals, operating at -40 to 125 °C. It supports a supply voltage range of 2.8V to 3.6V and is ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

$8.320

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$5.250

100+ parts

$4.940

1k+ parts

$4.460

10k+ parts

-

3,000

$5.250

$4.940

$4.460

-

DigiKey

USA . 884 parts In-Stock

1+ parts

$8.320

100+ parts

$5.470

1k+ parts

$5.078

10k+ parts

-

884

$8.320

$5.470

$5.078

-

Chip1Stop

Japan . 2,880 parts In-Stock

1+ parts

$27.400

100+ parts

$11.400

1k+ parts

$7.800

10k+ parts

-

2,880

$27.400

$11.400

$7.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 758 parts In-Stock

1+ parts

$4.988

100+ parts

-

1k+ parts

-

10k+ parts

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758

$4.988

-

-

-

Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

-

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9,000

-

-

-

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Vyrian

USA . 7,103 parts In-Stock

1+ parts

-

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7,103

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-

-

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Prism Electronics

USA . 2,267 parts In-Stock

1+ parts

-

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2,267

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-

-

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Netsource Technology, Inc.

USA . 1,218 parts In-Stock

1+ parts

-

100+ parts

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1,218

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 112 parts In-Stock

1+ parts

$4.725

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$4.725

-

-

-

Corohmni

South Africa . 324 parts In-Stock

1+ parts

$5.250

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$5.250

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,000

-

-

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Kulean Microsystems

USA . 7,443 parts In-Stock

1+ parts

-

100+ parts

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7,443

-

-

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TANS Electronics

Latvia . 4,948 parts In-Stock

1+ parts

-

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4,948

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-

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iodParts Technologies Inc.

India . 2,880 parts In-Stock

1+ parts

-

100+ parts

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2,880

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-

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SupplyDigital Components

Austria . 1,841 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,841

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Kepictronics

USA . 1,026 parts In-Stock

1+ parts

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1,026

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UHIMA Technologies

Türkiye . 658 parts In-Stock

1+ parts

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658

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Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

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500

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Problanco Electronics

Mexico . 116 parts In-Stock

1+ parts

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116

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Overview

Unleash the power of efficient and reliable power management with the NVT210CDM3R2G by Onsemi. Crafted with precision and expertise, this Power Management IC promises superior performance and durability. Ideal for automotive applications, this small outline, thin profile package delivers optimal supply voltage to ensure seamless operation. Say goodbye to power fluctuations and hello to smooth functioning with the NVT210CDM3R2G. Trust Onsemi for top-notch quality and innovation in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Easy to install and saves space on the PCB.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications requiring stable power supply.

No. of Terminals: 8

Offers flexibility in connection options.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for varying environments.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature conditions without issues.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply applications, ensuring efficient performance.

Minimum Supply Voltage (Vsup): 2.8 V

Allows for operation at lower supply voltages, increasing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperatures during the reflow process.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common.

No. of Channels: 2

Allows for managing power distribution for multiple components.

Terminal Form: GULL WING

Facilitates easy soldering onto the PCB.

Terminal Pitch: 0.65 mm

Provides a compact footprint for efficient board layout.

Maximum Supply Voltage (Vsup): 3.6 V

Handles higher supply voltages to meet various power requirements.

Technical Specifications

Power Management ICs NVT210CDM3R2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NVT210CDM3R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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