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NVD2955T4G

Onsemi

NVD2955T4G by Onsemi

NVD2955T4G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 18A IDM and 216mJ EAS, suitable for high-power operations. With a 0.18 ohm Drain-Source Resistance, it ensures efficient performance in various electronic systems.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 22,500 parts In-Stock

1+ parts

-

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$0.390

22,500

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$0.390

Flip Electronics (Authorized)

USA . 22,500 parts In-Stock

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22,500

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Verical

USA . 4,083 parts In-Stock

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$0.305

4,083

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$0.305

Rochester

USA . 4,083 parts In-Stock

1+ parts

-

100+ parts

$0.330

1k+ parts

$0.274

10k+ parts

$0.244

4,083

-

$0.330

$0.274

$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$0.269

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85

$0.269

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Bristol Electronics

USA . 357 parts In-Stock

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$0.938

100+ parts

$0.347

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$0.300

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357

$0.938

$0.347

$0.300

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Maritex

Poland . 2 parts In-Stock

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$0.968

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2

$0.968

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Chip Stock

USA . 80,000 parts In-Stock

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Flip Electronics

USA . 22,500 parts In-Stock

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Vyrian

USA . 22,484 parts In-Stock

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22,484

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ComSIT Distribution GmbH

Germany . 2,565 parts In-Stock

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Sensible Micro Corp

USA . 2,227 parts In-Stock

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2,227

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Cyclops Electronics Ltd

UK . 2,089 parts In-Stock

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Digiode

USA . 763 parts In-Stock

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LWI Electronics Inc

India . 15 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 167 parts In-Stock

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$0.264

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167

$0.264

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Argo Parts USA

USA . 1,514 parts In-Stock

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$0.269

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$0.261

1,514

$0.269

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$0.261

Continental Prestige Electronics

USA . 1,018 parts In-Stock

1+ parts

$0.269

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$0.264

1,018

$0.269

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$0.264

Netroflash

USA . 1,000 parts In-Stock

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$0.269

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1,000

$0.269

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Ampacity Inc.

Singapore . 22,170 parts In-Stock

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$1.350

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$1.350

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Authorized Procurement Solutions

USA . 45,000 parts In-Stock

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SupplyDigital Components

Austria . 6,977 parts In-Stock

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Kulean Microsystems

USA . 6,041 parts In-Stock

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Problanco Electronics

Mexico . 4,506 parts In-Stock

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TANS Electronics

Latvia . 3,004 parts In-Stock

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Infinite Electronics LLP (Excess)

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Component Connect

USA . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the high-quality NVD2955T4G Power FET from Onsemi. Designed for switching applications, this P-Channel transistor offers a reliable and efficient performance with its built-in diode configuration. With a maximum drain current of 12A and an operating temperature of 175°C, this transistor provides superior functionality in a compact small outline package. Elevate your designs with the trusted technology of metal-oxide semiconductor and enjoy the benefits of enhanced power dissipation and resistance. Make your projects stand out with the NVD2955T4G - the perfect choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product while keeping it lightweight.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for efficient current flow in this power FET, making it suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET simplifies circuit design and enhances the overall performance by ensuring proper current flow.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET offers fast and reliable switching capabilities.

Surface Mount: YES

The surface-mount feature allows for easy and space-efficient installation on circuit boards, making it ideal for compact designs.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this FET can handle high voltages, providing protection and stability in various applications.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in mounting options and ensures efficient heat dissipation for improved performance.

Terminal Form: GULL WING

The gull-wing terminal form enables easy soldering and secure connection, enhancing the overall reliability of the FET.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control and efficient power handling, making it well-suited for various applications.

Maximum Pulsed Drain Current (IDM): 18 A

With a high maximum pulsed drain current, this FET can handle sudden spikes in current, providing reliable performance under peak loads.

Avalanche Energy Rating (EAS): 216 mJ

The high avalanche energy rating ensures protection against voltage spikes and enhances the overall ruggedness of the FET.

Maximum Drain Current (Abs) (ID): 12 A

With a maximum drain current of 12 A, this FET can efficiently handle current flow in various applications.

No. of Terminals: 2

The two terminals provide easy and secure connectivity in circuit designs, ensuring a reliable electrical connection.

Maximum Power Dissipation (Abs): 55 W

The high maximum power dissipation allows for efficient heat dissipation, ensuring the FET operates at optimal temperatures for extended periods.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards and allows for compact designs without compromising performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance and reliability in power FET applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for demanding environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance, reliability, and efficient power handling.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and enhanced solderability for secure and long-lasting connections.

Maximum Drain-Source On Resistance: 0.18 ohm

With a low maximum drain-source on resistance, this FET offers efficient current flow and minimal power loss in operation.

Terminal Position: SINGLE

The single terminal position simplifies installation and ensures consistent electrical connections in circuit designs.

Case Connection: DRAIN

The drain case connection allows for easy mounting and efficient heat dissipation, enhancing the overall performance and reliability of the FET.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this FET can withstand high temperatures during the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections during the manufacturing process.

Reference Standard: AEC-Q101

Compliant with AEC-Q101 standards, this FET meets strict automotive industry requirements for reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) NVD2955T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

216 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD2955T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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