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NUS6160MNTWG

Onsemi

NUS6160MNTWG by Onsemi

NUS6160MNTWG by Onsemi is a surface mount peripheral driver with 22 terminals in a chip carrier package. It operates as a half bridge based peripheral driver with source output current flow direction. Ideal for applications requiring high peak reflow temperature and no lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,373 parts In-Stock

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13,373

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Digiode

USA . 381 parts In-Stock

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381

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,064 parts In-Stock

1+ parts

$13.040

100+ parts

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1,064

$13.040

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SupplyDigital Components

Austria . 5,729 parts In-Stock

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5,729

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Kulean Microsystems

USA . 4,643 parts In-Stock

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4,643

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TANS Electronics

Latvia . 2,199 parts In-Stock

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2,199

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Problanco Electronics

Mexico . 1,645 parts In-Stock

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1,645

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Corphita

USA . 874 parts In-Stock

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874

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Corohmni

South Africa . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 52 parts In-Stock

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52

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Overview

Experience the superior quality and reliability of the NUS6160MNTWG from Onsemi, a leading manufacturer in the industry. This peripheral driver offers seamless integration with its surface mount design and 22 terminals in a rectangular chip carrier package. Ideal for applications requiring a half-bridge based peripheral driver, this product ensures optimal performance and efficiency. Trust Onsemi to deliver exceptional value and benefits with the NUS6160MNTWG, providing customers with a reliable solution for their electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Easy and efficient installation on PCB boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Compact design allows for space-saving on the circuit board, ideal for applications with limited space.

No. of Terminals: 22

Provides flexibility in connecting multiple components and peripherals, allowing for versatile functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good thermal conduction properties, ensuring reliable performance under various operating conditions.

Terminal Finish: TIN

Tin terminals provide good conductivity and corrosion resistance, enhancing the overall durability of the product.

Terminal Position: QUAD

Quad terminal layout enables efficient routing of connections, resulting in improved signal integrity and performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes, making it suitable for modern manufacturing standards.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, making the product eco-friendly and safe for use.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

Half-bridge based peripheral driver offers efficient power management and control, enhancing the performance and reliability of the connected peripherals.

Output Current Flow Direction: SOURCE

Source current flow direction simplifies circuit design and enhances compatibility with various loads, making it a versatile choice for different applications.

Technical Specifications

Peripheral Drivers NUS6160MNTWG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N22

JESD-609 Code:

e3

No. of Terminals:

22

Output Current Flow Direction:

SOURCE

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

NUS6160MNTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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