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NUS2045MNT1G

Onsemi

NUS2045MNT1G by Onsemi

NUS2045MNT1G by Onsemi is a Power Management IC with 8 terminals, Vsup range of 3-25V, and operating temp from -40 to 85 °C. It is ideal for industrial applications requiring small outline, thin profile packages and support circuits for power supplies.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 21,998 parts In-Stock

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Digiode

USA . 1,143 parts In-Stock

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Vyrian

USA . 759 parts In-Stock

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Kepictronics

USA . 8,999 parts In-Stock

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SupplyDigital Components

Austria . 7,299 parts In-Stock

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Kulean Microsystems

USA . 7,249 parts In-Stock

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Problanco Electronics

Mexico . 6,812 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,877 parts In-Stock

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TANS Electronics

Latvia . 2,772 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,960 parts In-Stock

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Corohmni

South Africa . 391 parts In-Stock

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UHIMA Technologies

Türkiye . 258 parts In-Stock

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Overview

Unlock the power of efficient power management with the NUS2045MNT1G by Onsemi. Designed with precision and quality in mind, this surface mount power management IC offers a compact small outline package shape with a very thin profile. Ideal for industrial applications, this IC boasts a wide supply voltage range and low supply current, providing optimal performance and reliability. Trust Onsemi's expertise in power management ICs to deliver the value and benefits you need for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, especially in compact designs.

Nominal Supply Voltage (Vsup): 4.8 V

Stable nominal supply voltage ensures consistent power delivery to the connected components.

No. of Terminals: 8

Sufficient number of terminals for connecting to multiple power supplies or other components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connectivity options.

Width (mm): 3.3 mm

Compact width size enables space-saving design and efficient use of PCB real estate.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NUS2045MNT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

3.3 mm

Trade Compliance

NUS2045MNT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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