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NUS2045MNT1

Onsemi

NUS2045MNT1 by Onsemi

NUS2045MNT1 by Onsemi is a Power Management IC with 8 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 4.8V and supports up to 6 power supplies. This small outline, very thin profile IC is ideal for industrial applications requiring a max supply voltage of 25V and peak reflow temperature of 235 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,770 parts In-Stock

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7,770

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Digiode

USA . 2,209 parts In-Stock

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2,209

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Distributors (Availability)

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$18.930

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273

$18.930

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Component Stockers USA

USA . 760 parts In-Stock

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$99.990

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760

$99.990

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SupplyDigital Components

Austria . 8,316 parts In-Stock

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8,316

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TANS Electronics

Latvia . 6,051 parts In-Stock

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6,051

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Problanco Electronics

Mexico . 5,589 parts In-Stock

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5,589

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Kulean Microsystems

USA . 1,756 parts In-Stock

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1,756

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Corphita

USA . 1,296 parts In-Stock

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Corohmni

South Africa . 402 parts In-Stock

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402

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UHIMA Technologies

Türkiye . 164 parts In-Stock

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Overview

Elevate your power management game with the NUS2045MNT1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality power management ICs that are essential for a wide range of applications. This surface-mount device offers unparalleled reliability and efficiency, making it a must-have for any project requiring precise voltage regulation. With a small outline and very thin profile package style, this IC is perfect for space-constrained designs. Whether you're working on industrial machinery or consumer electronics, the NUS2045MNT1 provides the value, benefits, and advantages you need to take your product to the next level. Trust Onsemi for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Nominal Supply Voltage (Vsup): 4.8 V

The nominal supply voltage of 4.8 V ensures stable and reliable power supply for connected devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is designed to withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40 °C) makes this product suitable for use in various environmental conditions.

Maximum Supply Voltage (Vsup): 25 V

With a maximum supply voltage of 25 V, this power management IC can handle high voltage inputs, providing flexibility in design.

Technical Specifications

Power Management ICs NUS2045MNT1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

3.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.12,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

3.3 mm

Trade Compliance

NUS2045MNT1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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